发明申请
US20090279080A1 DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER
审中-公开
用于检查WAF边缘区域缺陷的装置和方法
- 专利标题： DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER
- 专利标题（中）： 用于检查WAF边缘区域缺陷的装置和方法
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申请号： US12494858申请日： 2009-06-30
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公开(公告)号： US20090279080A1公开(公告)日： 2009-11-12
- 发明人: Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
- 申请人： Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
- 申请人地址： DE Weilburg
- 专利权人： VISTEC SEMICONDUCTOR SYSTEMS GMBH
- 当前专利权人： VISTEC SEMICONDUCTOR SYSTEMS GMBH
- 当前专利权人地址： DE Weilburg
- 优先权： DE102007013655.4 20070319; DE102007047935.4 20071221
- 主分类号： G01N21/88
- IPC分类号： G01N21/88
摘要：
A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
信息查询
