Apparatus for the Optical Inspection of Wafers
    1.
    发明申请
    Apparatus for the Optical Inspection of Wafers 有权
    晶圆光学检测装置

    公开(公告)号:US20100295938A1

    公开(公告)日:2010-11-25

    申请号:US12716612

    申请日:2010-03-03

    IPC分类号: H04N7/18

    CPC分类号: G01N21/9501 G01N2021/8825

    摘要: An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.

    摘要翻译: 公开了一种用于光学检查晶片的设备(1),其包括:组装单元(10),其承载用于明场照明的至少一个照明路径(3)的光学元件(30,31,32,33),以及 用于暗场照明的至少一个照明路径(5,6,7,8)的光学元件(50,51,52,60,61,62,70,71,72,80,81,82)。 组装单元(10)还承载至少一个检测路径(91,92)的多个光学元件(91,92,93,94,95,96,97,98,99,100)。 用于明场照明(30)的至少一个照明路径(3)的成像光学元件(32),用于暗场照明的至少一个照明路径的成像光学元件(51,61,71,81) ,并且所述至少一个检测路径(9)的成像光学元件(91,95,96)被设计成使得所有照明路径(3,5,6,7,8)和所有检测路径(91, 92)是远心的。

    DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER
    2.
    发明申请
    DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER 审中-公开
    用于检查WAF边缘区域缺陷的装置和方法

    公开(公告)号:US20090279080A1

    公开(公告)日:2009-11-12

    申请号:US12494858

    申请日:2009-06-30

    IPC分类号: G01N21/88

    CPC分类号: G01N21/9503 G01N2021/8825

    摘要: A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.

    摘要翻译: 公开了一种用于检查晶片(6)的边缘区域上的缺陷的方法,装置和应用。 至少一个照明装置(41)照亮晶片(6)的边缘区域(6a)。 提供至少一个光学单元(40),所述光学单元(40)可相对于所述晶片(6a)的边缘的顶表面(30)定位以抵抗所述缺陷(88)的位置或底表面 (6a)的边缘的边缘(31)或晶片(6a)的边缘的面(32),用于捕获所述缺陷的图像。

    Apparatus for measuring feature widths on masks for the semiconductor industry
    3.
    发明授权
    Apparatus for measuring feature widths on masks for the semiconductor industry 有权
    用于半导体工业的掩模测量特征宽度的装置

    公开(公告)号:US07375792B2

    公开(公告)日:2008-05-20

    申请号:US10711424

    申请日:2004-09-17

    IPC分类号: G03B27/42

    摘要: An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.

    摘要翻译: 公开了一种用于测量半导体工业的掩模1上的特征宽度的装置。 该装置包括在基架14中以振动解耦方式保持的承载板16; 布置在承载板16上的扫描台18,其承载待测量的掩模1,掩模1限定表面4; 以及与掩模1相对布置的物镜2。 液体25设置在物镜2和掩模1的表面4之间。

    Apparatus for the optical inspection of wafers
    5.
    发明授权
    Apparatus for the optical inspection of wafers 有权
    用于光学检查晶片的装置

    公开(公告)号:US08451440B2

    公开(公告)日:2013-05-28

    申请号:US12716612

    申请日:2010-03-03

    IPC分类号: G01N21/00 G01N21/95

    CPC分类号: G01N21/9501 G01N2021/8825

    摘要: An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.

    摘要翻译: 公开了一种用于光学检查晶片的设备(1),其包括:组装单元(10),其承载用于明场照明的至少一个照明路径(3)的光学元件(30,31,32,33),以及 用于暗场照明的至少一个照明路径(5,6,7,8)的光学元件(50,51,52,60,61,62,70,71,72,80,81,82)。 组装单元(10)还承载至少一个检测路径(91,92)的多个光学元件(91,92,93,94,95,96,97,98,99,100)。 用于明场照明(30)的至少一个照明路径(3)的成像光学元件(32),用于暗场照明的至少一个照明路径的成像光学元件(51,61,71,81) ,并且所述至少一个检测路径(9)的成像光学元件(91,95,96)被设计成使得所有照明路径(3,5,6,7,8)和所有检测路径(91, 92)是远心的。

    Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers
    6.
    发明授权
    Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers 有权
    用于评估晶片边缘区域中的缺陷并在晶片检查系统中使用该装置的装置和方法

    公开(公告)号:US08089622B2

    公开(公告)日:2012-01-03

    申请号:US12039047

    申请日:2008-02-28

    IPC分类号: G01N21/00 G06K9/62

    CPC分类号: G01N21/9503

    摘要: A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).

    摘要翻译: 公开了一种用于评估晶片(6)的边缘区域中的缺陷的装置。 评价也可以自动进行。 特别地,该装置包括三个相机(25,26,27),每个相机设置有物镜(30),其中第一相机(25)布置成使得第一相机(25)与第一相机 晶片(6)的上表面(6a),其中第二相机(26)布置成使得第二相机(26)与晶片(6)的前表面(6b)相对,并且其中第三相机 (27)被布置成使得第三相机(27)与晶片(6)的下表面(6c)上的边缘区域相对。

    Device and method for scanning the whole surface of a wafer
    7.
    发明申请
    Device and method for scanning the whole surface of a wafer 审中-公开
    用于扫描晶片整个表面的装置和方法

    公开(公告)号:US20090034832A1

    公开(公告)日:2009-02-05

    申请号:US12220532

    申请日:2008-07-25

    IPC分类号: G06K9/00

    CPC分类号: G01N21/9501

    摘要: A device and a method for scanning the whole surface of a wafer are disclosed. The wafer is deposited on a table movable in the X-coordinate direction and in the Y-coordinate direction. A camera and at least one illumination source are arranged opposite the wafer. The camera is a line camera with a detector row, wherein the length of the detector row is less than the diameter of the wafer.

    摘要翻译: 公开了一种用于扫描晶片的整个表面的装置和方法。 晶片沉积在可沿X坐标方向和Y坐标方向移动的工作台上。 照相机和至少一个照明源布置在晶片对面。 相机是具有检测器行的线相机,其中检测器行的长度小于晶片的直径。

    Method for Selecting a Wavelength, and a Microscope
    8.
    发明申请
    Method for Selecting a Wavelength, and a Microscope 审中-公开
    选择波长的方法和显微镜

    公开(公告)号:US20080062510A1

    公开(公告)日:2008-03-13

    申请号:US11759188

    申请日:2007-06-06

    IPC分类号: G02B21/00 G01J3/28

    CPC分类号: G02B21/06 G02B21/16

    摘要: A method is disclosed for selecting a minimum of one wavelength 320 or a minimum of one wavelength range 206 of electromagnetic radiation to be used for object testing, whereby a first spectrum is captured or calculated on a first point of a first object 509, a second spectrum is captured or calculated on a second point of the first 509 or a second object, a difference spectrum is formed from the first and the second spectrum, and the minimum of one wavelength 320 or minimum of one wavelength range 26 is selected in the difference spectrum according to predetermined criteria; as well as a microscope 500 with means of the illumination 502, capture 503, and analysis 504, whereby the illumination means illuminate an object 509, and the capture means capture a first spectrum on a first point on a first object, the capture means capture a second spectrum on a second point of the first or on a second object, and the analysis means form a difference spectrum as a difference between the first and the second spectrum. The disclosed invention enables selection of an optimally suited wavelength for object testing.

    摘要翻译: 公开了一种用于选择要用于对象测试的电磁辐射的一个波长320或最小一个波长范围206的最小值的方法,由此在第一对象509的第一点上捕获或计算第一光谱,第二光谱 在第一个509或第二个物体的第二个点上捕获或计算光谱,从第一和第二光谱形成差分光谱,并且在差异中选择一个波长320或最小值一个波长范围26的最小值 频谱根据预定标准; 以及具有照明502,捕获503和分析504的装置的显微镜500,由此照明装置照射物体509,并且捕获装置在第一物体上的第一点捕获第一光谱,捕获装置捕获 在第一或第二物体的第二点上的第二光谱,并且分析装置形成差光谱作为第一和第二光谱之间的差。 所公开的发明使得能够选择用于对象测试的最适合的波长。

    Method for manufacturing ultraviolet microscope dry objectives and
microscope objectives manufactured in accordance with this method
    9.
    发明授权
    Method for manufacturing ultraviolet microscope dry objectives and microscope objectives manufactured in accordance with this method 失效
    用于制造根据该方法制造的紫外线干物镜和显微镜物镜的方法

    公开(公告)号:US5440422A

    公开(公告)日:1995-08-08

    申请号:US76121

    申请日:1993-06-14

    申请人: Wolfgang Vollrath

    发明人: Wolfgang Vollrath

    IPC分类号: G02B13/14 G02B21/02 G02B11/34

    CPC分类号: G02B13/143 G02B21/02

    摘要: A method for the manufacture of quasi-monochromatic microscope dry objectives for a wavelength range from 190 to 360 nanometers proceeds from a basic objective with a specified number of lenses. The basic objective is corrected for a specified wavelength with respect to image aberrations. By using lenses with slightly different production thicknesses and by arranging the lenses at different air separations, objectives for other areas of application are created. All of the objectives have the same number of lenses and virtually the same resolution. The data for three objectives derived from a basic objective are provided as an example.

    摘要翻译: 用于制造波长范围为190至360纳米的准单色显微镜干物镜的方法是从具有指定数量的透镜的基本目标进行。 相对于图像像差,对于指定波长校正基本目标。 通过使用具有稍微不同的生产厚度的透镜,并且通过将透镜布置在不同的空气分离处,产生用于其它应用领域的目的。 所有的目标都具有相同数量的镜头和几乎相同的分辨率。 提供了从基本目标衍生出的三个目标的数据作为示例。

    Dark Field Objective for a Microscope
    10.
    发明申请
    Dark Field Objective for a Microscope 审中-公开
    显微镜的暗场目标

    公开(公告)号:US20090225414A1

    公开(公告)日:2009-09-10

    申请号:US12083108

    申请日:2006-09-24

    IPC分类号: G02B21/10

    CPC分类号: G02B21/10

    摘要: The invention relates to an objective for a microscope for dark field microscopy having alternating illumination with grazing incidence. A dark field objective is shown having a front lens for receiving light from a sample and having a dark field illumination device for guiding illumination light onto the sample, the dark field illumination device comprising at least one pair of light decoupling elements, which are each situated in pairs around the front lens opposite to the optical axis for counter parallel illumination of the sample.

    摘要翻译: 本发明涉及一种用于暗视野显微镜的显微镜的目标,其具有具有掠入射的交替照明。 暗场物镜被示出具有用于接收来自样品的光的前透镜,并具有用于将照明光引导到样品上的暗场照明装置,该暗场照明装置包括至少一对光去耦元件, 成对地围绕与镜片相反的前透镜,用于样品的平行平行照明。