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公开(公告)号：US20090086483A1
公开(公告)日：2009-04-02
申请号：US12286253
申请日：2008-09-29
IPC分类号： F21V1/00
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2201/0626 , G01N2201/0627 , G01N2201/0634
摘要： An illumination mean for the inspection of flat substrates is disclosed. The flat substrate includes an upper edge area, a lower edge area and a front area. The illumination means is formed as an annular segment and comprises an opening into which at least the edge area of the flat substrate extends. A plurality of light sources are arranged on an annular segment in a housing. Inside the housing, a reflective element is provided so that the light from the light sources does not impinge perpendicularly on the upper edge area, the lower edge area and the front area of the flat substrate.
摘要翻译： 公开了用于检查平板基板的照明平均值。 平面基板包括上边缘区域，下边缘区域和前部区域。 照明装置形成为环形部分，并且包括至少平坦基板的边缘区域延伸到的开口。 多个光源布置在壳体中的环形部分上。 在壳体内部，设置反射元件，使得来自光源的光线不会垂直地照射在平坦基板的上边缘区域，下边缘区域和前部区域上。
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公开(公告)号：US20080144025A1
公开(公告)日：2008-06-19
申请号：US11999611
申请日：2007-12-06
IPC分类号： G01J3/00
CPC分类号： G01N21/9501 , G01N21/8806
摘要： An apparatus for inspecting a wafer, comprising at least one illuminator each arranged in an illumination beam path, wherein the at least one illuminator radiates an illumination spot onto a surface of the wafer and being a continuous light source; a detector arranged in a detection beam path has a predetermined spectral sensitivity and records data from the at least one illumination spot from the surface of the wafer; an imager generating a relative movement between the surface of the wafer and the detector, whereby in a meandering movement the illumination spot is passed across the entire surface of the wafer in the scanning direction; and the at least one illumination spot being detected in a plurality of different spectral ranges.
摘要翻译： 一种用于检查晶片的装置，包括每个布置在照明光束路径中的至少一个照明器，其中所述至少一个照明器将照明点辐射到所述晶片的表面上并且是连续的光源; 布置在检测光束路径中的检测器具有预定的光谱灵敏度并记录来自晶片表面的至少一个照明点的数据; 成像器在晶片的表面和检测器之间产生相对运动，由此在曲折运动中，照射点在扫描方向上穿过晶片的整个表面; 并且所述至少一个照明点在多个不同的光谱范围内被检测。
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公开(公告)号：US08087799B2
公开(公告)日：2012-01-03
申请号：US12286253
申请日：2008-09-29
IPC分类号： F21V1/04
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2201/0626 , G01N2201/0627 , G01N2201/0634
摘要： An illumination mean for the inspection of flat substrates is disclosed. The flat substrate includes an upper edge area, a lower edge area and a front area. The illumination means is formed as an annular segment and comprises an opening into which at least the edge area of the flat substrate extends. A plurality of light sources are arranged on an annular segment in a housing. Inside the housing, a reflective element is provided so that the light from the light sources does not impinge perpendicularly on the upper edge area, the lower edge area and the front area of the flat substrate.
摘要翻译： 公开了用于检查平板基板的照明平均值。 平面基板包括上边缘区域，下边缘区域和前部区域。 照明装置形成为环形部分，并且包括至少平坦基板的边缘区域延伸到的开口。 多个光源布置在壳体中的环形部分上。 在壳体内部，设置反射元件，使得来自光源的光线不会垂直地照射在平坦基板的上边缘区域，下边缘区域和前部区域上。
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公开(公告)号：US20100295938A1
公开(公告)日：2010-11-25
申请号：US12716612
申请日：2010-03-03
申请人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
发明人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
IPC分类号： H04N7/18
CPC分类号： G01N21/9501 , G01N2021/8825
摘要： An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要翻译： 公开了一种用于光学检查晶片的设备（1），其包括：组装单元（10），其承载用于明场照明的至少一个照明路径（3）的光学元件（30,31,32,33），以及 用于暗场照明的至少一个照明路径（5,6,7,8）的光学元件（50,51,52,60,61,62,70,71,72,80,81,82）。 组装单元（10）还承载至少一个检测路径（91,92）的多个光学元件（91,92,93,94,95,96,97,98,99,100）。 用于明场照明（30）的至少一个照明路径（3）的成像光学元件（32），用于暗场照明的至少一个照明路径的成像光学元件（51,61,71,81） ，并且所述至少一个检测路径（9）的成像光学元件（91,95,96）被设计成使得所有照明路径（3,5,6,7,8）和所有检测路径（91， 92）是远心的。
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5.发明申请DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER 审中-公开用于检查WAF边缘区域缺陷的装置和方法公开(公告)号：US20090279080A1
公开(公告)日：2009-11-12
申请号：US12494858
申请日：2009-06-30
申请人： Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
发明人： Lambert Danner , Michael Heiden , Wolfgang Vollrath , Alexander Buttner , Christof Krampe-Zadler
IPC分类号： G01N21/88
CPC分类号： G01N21/9503 , G01N2021/8825
摘要： A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
摘要翻译： 公开了一种用于检查晶片（6）的边缘区域上的缺陷的方法，装置和应用。 至少一个照明装置（41）照亮晶片（6）的边缘区域（6a）。 提供至少一个光学单元（40），所述光学单元（40）可相对于所述晶片（6a）的边缘的顶表面（30）定位以抵抗所述缺陷（88）的位置或底表面 （6a）的边缘的边缘（31）或晶片（6a）的边缘的面（32），用于捕获所述缺陷的图像。
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公开(公告)号：US20080144014A1
公开(公告)日：2008-06-19
申请号：US11999640
申请日：2007-12-06
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/8806
摘要： An apparatus for inspecting a wafer, comprising a first illuminator for radiating an illumination beam in a first illumination beam path onto a surface of the wafer and being configured as continuous light source; a second illuminator for radiating an illumination light beam in a second illumination beam path onto a surface of the wafer and being configured as continuous light source; a first detector means defining a first detection beam path; a second detector means defining a second detection beam path, wherein the first and the second detector means have a predetermined spectral sensitivity and detect data of at least an illuminated area moveable in a scanning direction on the surface of the wafer in a plurality of different spectral ranges.
摘要翻译： 一种用于检查晶片的装置，包括：第一照明器，用于将第一照明光束路径中的照明光束照射到晶片的表面上并被配置为连续光源; 第二照明器，用于将第二照明光束路径中的照明光束照射到晶片的表面上并被配置为连续光源; 限定第一检测光束路径的第一检测器装置; 限定第二检测光束路径的第二检测器装置，其中第一和第二检测器装置具有预定的光谱灵敏度，并且以多个不同的光谱检测在晶片表面上沿扫描方向可移动的至少一个照明区域的数据 范围。
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7.发明申请Method of optically imaging and inspecting a wafer in the context of edge bead removal 审中-公开在边缘珠去除的上下文中光学成像和检查晶片的方法公开(公告)号：US20060286811A1
公开(公告)日：2006-12-21
申请号：US11454740
申请日：2006-06-16
IPC分类号： H01L21/469
CPC分类号： G01N21/6456 , G01N21/9501 , G01N21/9503
摘要： The present invention relates to a method of optically imaging a wafer with a photoresist layer, wherein an imaging area on the surface of the wafer is illuminated with light and a fluorescence image is taken in the imaging area based on the fluorescent light irradiated due to the illumination by the excitation light.
摘要翻译： 本发明涉及一种利用光致抗蚀剂层对晶片进行光学成像的方法，其中用光照射晶片表面上的成像区域，并且基于由于该光刻胶照射的荧光而在成像区域中拍摄荧光图像 通过激发光照明。
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公开(公告)号：US08451440B2
公开(公告)日：2013-05-28
申请号：US12716612
申请日：2010-03-03
申请人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
发明人： Kurt Hahn , Roland Hedrich , Gerhard Hoppen , Lambert Danner , Albert Kreh , Wolfgang Vollrath , Alexander Büttner , Christof Krampe-Zadler , Henning Backhauss , Hermann Bittner
CPC分类号： G01N21/9501 , G01N2021/8825
摘要： An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要翻译： 公开了一种用于光学检查晶片的设备（1），其包括：组装单元（10），其承载用于明场照明的至少一个照明路径（3）的光学元件（30,31,32,33），以及 用于暗场照明的至少一个照明路径（5,6,7,8）的光学元件（50,51,52,60,61,62,70,71,72,80,81,82）。 组装单元（10）还承载至少一个检测路径（91,92）的多个光学元件（91,92,93,94,95,96,97,98,99,100）。 用于明场照明（30）的至少一个照明路径（3）的成像光学元件（32），用于暗场照明的至少一个照明路径的成像光学元件（51,61,71,81） ，并且所述至少一个检测路径（9）的成像光学元件（91,95,96）被设计成使得所有照明路径（3,5,6,7,8）和所有检测路径（91， 92）是远心的。
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公开(公告)号：US20090034832A1
公开(公告)日：2009-02-05
申请号：US12220532
申请日：2008-07-25
IPC分类号： G06K9/00
CPC分类号： G01N21/9501
摘要： A device and a method for scanning the whole surface of a wafer are disclosed. The wafer is deposited on a table movable in the X-coordinate direction and in the Y-coordinate direction. A camera and at least one illumination source are arranged opposite the wafer. The camera is a line camera with a detector row, wherein the length of the detector row is less than the diameter of the wafer.
摘要翻译： 公开了一种用于扫描晶片的整个表面的装置和方法。 晶片沉积在可沿X坐标方向和Y坐标方向移动的工作台上。 照相机和至少一个照明源布置在晶片对面。 相机是具有检测器行的线相机，其中检测器行的长度小于晶片的直径。
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公开(公告)号：US20070013902A1
公开(公告)日：2007-01-18
申请号：US11422182
申请日：2006-06-05
IPC分类号： G01N21/88
CPC分类号： G01N21/8806 , G01N21/9501
摘要： The present invention relates to an apparatus and method for automatically inspecting a wafer, having a light source and an illumination optics for illuminating the wafer for inspection, wherein the illumination optics comprises a variable gray filter for adjusting the illumination power.
摘要翻译： 本发明涉及一种用于自动检查晶片的装置和方法，该晶片具有光源和用于照射晶片以进行检查的照明光学元件，其中该照明光学器件包括用于调节照明功率的可变灰度滤光片。
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