Apparatus for the optical inspection of wafers
    1.
    发明授权
    Apparatus for the optical inspection of wafers 有权
    用于光学检查晶片的装置

    公开(公告)号:US08451440B2

    公开(公告)日:2013-05-28

    申请号:US12716612

    申请日:2010-03-03

    CPC classification number: G01N21/9501 G01N2021/8825

    Abstract: An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.

    Abstract translation: 公开了一种用于光学检查晶片的设备(1),其包括:组装单元(10),其承载用于明场照明的至少一个照明路径(3)的光学元件(30,31,32,33),以及 用于暗场照明的至少一个照明路径(5,6,7,8)的光学元件(50,51,52,60,61,62,70,71,72,80,81,82)。 组装单元(10)还承载至少一个检测路径(91,92)的多个光学元件(91,92,93,94,95,96,97,98,99,100)。 用于明场照明(30)的至少一个照明路径(3)的成像光学元件(32),用于暗场照明的至少一个照明路径的成像光学元件(51,61,71,81) ,并且所述至少一个检测路径(9)的成像光学元件(91,95,96)被设计成使得所有照明路径(3,5,6,7,8)和所有检测路径(91, 92)是远心的。

    Apparatus and method for inspecting micro-structured devices on a semiconductor substrate
    2.
    发明授权
    Apparatus and method for inspecting micro-structured devices on a semiconductor substrate 有权
    用于检查半导体衬底上的微结构器件的装置和方法

    公开(公告)号:US08154718B2

    公开(公告)日:2012-04-10

    申请号:US11568949

    申请日:2005-05-23

    CPC classification number: G02B21/088 G01N21/59 G01N21/9501 G01N21/9505

    Abstract: Previously used examination devices and methods mostly operate with reflected visible or UV light to analyze microstructured samples of a wafer (38), for example. The aim of the invention is to increase the possible uses of said devices, i.e. particularly in order to represent structural details, e.g. of wafers that are structured on both sides, which are not visible in VIS or UV because coatings or intermediate materials are not transparent. Said aim is achieved by using IR light as reflected light while creating transillumination (52) which significantly improves contrast in the IR image, among other things, thus allowing the sample to be simultaneously represented in reflected or transmitted IR light and in reflected visible light.

    Abstract translation: 以前使用的检查装置和方法大多以反射的可见光或UV光来操作,以分析例如晶片(38)的微结构样品。 本发明的目的是增加所述装置的可能用途,即特别是为了表示结构细节,例如, 的两面结构的晶片,其在VIS或UV中不可见,因为涂层或中间材料不透明。 所述目的通过使用IR光作为反射光来实现,同时产生透光(52),其显着地改善了IR图像中的对比度,从而允许样品在反射或透射的IR光和反射的可见光中同时被表示。

    Measuring instrument and method for operating a measuring instrument for optical inspection of an object
    3.
    发明授权
    Measuring instrument and method for operating a measuring instrument for optical inspection of an object 有权
    用于操作用于物体光学检查的测量仪器的测量仪器和方法

    公开(公告)号:US07420670B2

    公开(公告)日:2008-09-02

    申请号:US11127002

    申请日:2005-05-11

    CPC classification number: G03F1/84 G02B21/0016 G02B27/58 G03F7/70616

    Abstract: A measuring instrument for optical inspection of an object includes a light source for illuminating an object; a detector; an illuminating beam path extending from the light source to the object; a detection beam path extending from the object to the detector; an illuminating optics disposed in the illuminating beam path and/or an imaging optics disposed in the detection beam path for imaging the object onto the detector; a position evaluation device for determining a distance between two points of the object; and an optical device for imposing a profile of a continuously monotonic function on an intensity of light from the light source. The optical device is disposed in at least one of a pupil plane of the imaging optics, a pupil plane of the illuminating optics, and a plane in the illuminating or imaging beam path conjugate with the pupil plane of the imaging optics or the pupil plane of the illuminating optics.

    Abstract translation: 用于物体的光学检查的测量仪器包括用于照亮物体的光源; 检测器 从光源延伸到物体的照明光束路径; 从物体延伸到检测器的检测光束路径; 设置在照明光束路径中的照明光学器件和/或设置在检测光束路径中的成像光学器件,用于将物体成像到检测器上; 位置评估装置,用于确定所述物体的两个点之间的距离; 以及用于对来自光源的光的强度施加连续单调函数的轮廓的光学装置。 光学装置设置在成像光学器件的光瞳平面中,照明光学器件的光瞳面和照明或成像光束路径中的平面与成像光学器件的光瞳平面或瞳孔平面中的至少一个 照明光学。

    Method and device for reducing systematic measuring errors in the examination of objects
    4.
    发明申请
    Method and device for reducing systematic measuring errors in the examination of objects 审中-公开
    减少物体检查中系统测量误差的方法和装置

    公开(公告)号:US20070035850A1

    公开(公告)日:2007-02-15

    申请号:US11500502

    申请日:2006-08-08

    Abstract: In the production of semiconductor or other components, the structures are normally manufactured in different planes. In the orientation of these planes relative to each other a displacement or alignment is examined, among other things, and detected as an overlay defect. To reduce a systematic measuring defect a measuring device (10) is provided for measuring the overlay defect. This device has an illuminating device (12), a lens or objective (14) for focusing radiation from the illuminating device (12) onto the object (16) and a tube lens (18) for imaging the radiation onto a sensor unit (20). A compensator (22), in which the wave fronts of the incident radiation are tilted with spectral variation such that the axial transverse chromatic aberration is compensated for, is provided in the path of rays of the measuring device (10).

    Abstract translation: 在半导体或其他部件的制造中,通常在不同的平面上制造结构。 在这些平面相对于彼此的方向上,检查位移或对准,并且被检测为覆盖缺陷。 为了减少系统的测量缺陷,提供了用于测量覆盖缺陷的测量装置(10)。 该装置具有照明装置(12),用于将来自照明装置(12)的辐射聚焦到物体(16)上的透镜或物镜(14)和用于将辐射成像到传感器单元(20)上的管透镜 )。 在测量装置(10)的射线的路径中设置补偿器(22),其中入射辐射的波前沿光谱变化倾斜以使轴向横向色像差被补偿。

    Illumination device; and coordinate measuring instrument having an illumination device
    5.
    发明授权
    Illumination device; and coordinate measuring instrument having an illumination device 有权
    照明装置; 和具有照明装置的坐标测量仪器

    公开(公告)号:US06975409B2

    公开(公告)日:2005-12-13

    申请号:US09893998

    申请日:2001-06-29

    Abstract: An illumination device according to the present invention comprises a light source (1), an optical fiber bundle (4), a coupling-in optical system (3) before and a coupling-out optical system (5) after the fiber bundle (4), and an illuminating optical system (17; 20). A homogenizing optical system (6) between the coupling-out optical system (5) and illuminating optical system (17; 20) brings about a homogenization of the intensity distribution in the image field. The homogenizing optical system (6) advantageously comprises a micro-honeycomb condenser (7) and a lens member (8) which superimpose the exit opening of the fiber bundle (4) in an intermediate image plane (10) to form a homogeneous intermediate image. The coordinate measuring instrument comprises an X-Y measurement stage (26) for receiving a substrate with a feature (31) that is to be measured, an illumination system with a light source (1), an optical fiber bundle (4), a coupling-in optical system (3), a coupling-out optical system (5), an illuminating optical system (17; 20) for illuminating an image field on the substrate, and a detector device (14) for determining the position of the feature. A homogenizing optical system (6) between the coupling-out optical system (5) and illuminating optical system (17; 20) brings about a homogenization of the intensity distribution in the image field.

    Abstract translation: 根据本发明的照明装置包括光源(1),光纤束(4),之前的耦合光学系统(3)和光纤束(4)之后的耦合光学系统(5) )和照明光学系统(17; 20)。 耦合出光学系统(5)和照明光学系统(17; 20)之间的均匀化光学系统(6)导致图像场中强度分布的均匀化。 均匀化光学系统(6)有利地包括微蜂窝聚光器(7)和将纤维束(4)的出口开口叠加在中间图像平面(10)中的透镜构件(8),以形成均匀的中间图像 。 坐标测量仪器包括用于接收具有要被测量的特征(31)的基板的XY测量台(26),具有光源(1)的光照系统,光纤束(4),耦合 - 在光学系统(3)中,耦合输出光学系统(5),用于照射基板上的图像场的照明光学系统(17; 20)以及用于确定特征位置的检测器装置(14)。 耦合出光学系统(5)和照明光学系统(17; 20)之间的均匀化光学系统(6)导致图像场中强度分布的均匀化。

    Measuring instrument and method for operating a measuring instrument for optical inspection of an object
    6.
    发明申请
    Measuring instrument and method for operating a measuring instrument for optical inspection of an object 有权
    用于操作用于物体光学检查的测量仪器的测量仪器和方法

    公开(公告)号:US20050254068A1

    公开(公告)日:2005-11-17

    申请号:US11127002

    申请日:2005-05-11

    CPC classification number: G03F1/84 G02B21/0016 G02B27/58 G03F7/70616

    Abstract: A measuring instrument for optical inspection of an object includes a light source for illuminating an object; a detector; an illuminating beam path extending from the light source to the object; a detection beam path extending from the object to the detector; an illuminating optics disposed in the illuminating beam path and/or an imaging optics disposed in the detection beam path for imaging the object onto the detector; a position evaluation device for determining a distance between two points of the object; and an optical device for imposing a profile of a continuously monotonic function on an intensity of light from the light source. The optical device is disposed in at least one of a pupil plane of the imaging optics, a pupil plane of the illuminating optics, and a plane in the illuminating or imaging beam path conjugate with the pupil plane of the imaging optics or the pupil plane of the illuminating optics.

    Abstract translation: 用于物体的光学检查的测量仪器包括用于照亮物体的光源; 检测器 从光源延伸到物体的照明光束路径; 从物体延伸到检测器的检测光束路径; 设置在照明光束路径中的照明光学器件和/或设置在检测光束路径中的成像光学器件,用于将物体成像到检测器上; 位置评估装置,用于确定所述物体的两个点之间的距离; 以及用于对来自光源的光的强度施加连续单调函数的轮廓的光学装置。 光学装置设置在成像光学器件的光瞳平面中,照明光学器件的光瞳面和照明或成像光束路径中的平面与成像光学器件的光瞳平面或瞳孔平面中的至少一个 照明光学。

    Critical dimension measuring instrument
    7.
    发明授权
    Critical dimension measuring instrument 失效
    关键尺寸测量仪

    公开(公告)号:US06943901B2

    公开(公告)日:2005-09-13

    申请号:US10672048

    申请日:2003-09-26

    CPC classification number: G01B11/00

    Abstract: A critical dimension measuring instrument includes a light source, a beam-shaping optical system, a condenser having a condenser pupil, a first microlens array arrangement, a first auxiliary optical element having positive refractive power, a second auxiliary optical element having positive refractive power, and a second microlens array arrangement. The first microlens array arrangement, the first auxiliary optical element, the second auxiliary optical element and the second microlens array arrangement are arranged in successive fashion between the beam-shaping optical system and the condenser.

    Abstract translation: 临界尺寸测量仪器包括光源,光束整形光学系统,具有聚光光瞳的冷凝器,第一微透镜阵列布置,具有正屈光力的第一辅助光学元件,具有正折光力的第二辅助光学元件, 和第二微透镜阵列布置。 第一微透镜阵列布置,第一辅助光学元件,第二辅助光学元件和第二微透镜阵列布置以连续的方式布置在光束整形光学系统和冷凝器之间。

    Method for focusing an object plane and optical assembly
    8.
    发明申请
    Method for focusing an object plane and optical assembly 有权
    聚焦物平面和光学组件的方法

    公开(公告)号:US20110205553A1

    公开(公告)日:2011-08-25

    申请号:US12931886

    申请日:2011-02-14

    CPC classification number: G01B9/04 G02B7/38

    Abstract: A method for focusing an object plane (42) through an objective (30) and an optical assembly (10), with which the method can be carried out, are disclosed. A geometric reference structure (21) is positioned in a plane (36) conjugate to a field plane (34) of the objective (30) and is imaged onto the object plane (42). The geometric reference structure (21) is illuminated with a light beam (24), which encloses a non-zero angle (φ) with a normal direction (38) of the conjugate plane (36). Therefore a position (Y) of an image (22) of the geometric reference structure (21) in the object plane (42) depends on the signed distance (37) between the object plane (42) and the field plane (34), and correspondingly is evaluated for the determination of the focus position. The optical assembly (10) preferentially may be a metrology tool (100) for measuring structures (120) on masks (100), wherein the objective (30) is the measurement objective of the metrology tool (100).

    Abstract translation: 公开了一种用于将物平面(42)聚焦通过物镜(30)和光学组件(10)进行该方法可以实现的方法。 几何参考结构(21)位于与物镜(30)的场平面(34)共轭的平面(36)中,并被成像到物平面(42)上。 几何参考结构(21)用光束(24)照射,光束(24)与共轭平面(36)的法线方向(38)包围非零角度(&phgr)。 因此,物平面(42)中的几何参考结构(21)的图像(22)的位置(Y)取决于物平面(42)和场平面(34)之间的有符号距离(37) 并且相应地评估焦点位置的确定。 光学组件(10)优选地可以是用于测量掩模(100)上的结构(120)的计量工具(100),其中物镜(30)是计量工具(100)的测量目标。

    Apparatus for the Optical Inspection of Wafers
    9.
    发明申请
    Apparatus for the Optical Inspection of Wafers 有权
    晶圆光学检测装置

    公开(公告)号:US20100295938A1

    公开(公告)日:2010-11-25

    申请号:US12716612

    申请日:2010-03-03

    CPC classification number: G01N21/9501 G01N2021/8825

    Abstract: An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.

    Abstract translation: 公开了一种用于光学检查晶片的设备(1),其包括:组装单元(10),其承载用于明场照明的至少一个照明路径(3)的光学元件(30,31,32,33),以及 用于暗场照明的至少一个照明路径(5,6,7,8)的光学元件(50,51,52,60,61,62,70,71,72,80,81,82)。 组装单元(10)还承载至少一个检测路径(91,92)的多个光学元件(91,92,93,94,95,96,97,98,99,100)。 用于明场照明(30)的至少一个照明路径(3)的成像光学元件(32),用于暗场照明的至少一个照明路径的成像光学元件(51,61,71,81) ,并且所述至少一个检测路径(9)的成像光学元件(91,95,96)被设计成使得所有照明路径(3,5,6,7,8)和所有检测路径(91, 92)是远心的。

    DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER
    10.
    发明申请
    DEVICE AND METHOD FOR THE INSPECTION OF DEFECTS ON THE EDGE REGION OF A WAFER 审中-公开
    用于检查WAF边缘区域缺陷的装置和方法

    公开(公告)号:US20090279080A1

    公开(公告)日:2009-11-12

    申请号:US12494858

    申请日:2009-06-30

    CPC classification number: G01N21/9503 G01N2021/8825

    Abstract: A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.

    Abstract translation: 公开了一种用于检查晶片(6)的边缘区域上的缺陷的方法,装置和应用。 至少一个照明装置(41)照亮晶片(6)的边缘区域(6a)。 提供至少一个光学单元(40),所述光学单元(40)可相对于所述晶片(6a)的边缘的顶表面(30)定位以抵抗所述缺陷(88)的位置或底表面 (6a)的边缘的边缘(31)或晶片(6a)的边缘的面(32),用于捕获所述缺陷的图像。

Patent Agency Ranking