摘要:
A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.
摘要:
An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要:
An apparatus (1) for the optical inspection of wafers is disclosed, which comprises an assembly unit (10) which carries optical elements (30, 31, 32, 33) of at least one illumination path (3) for a bright field illumination and optical elements (50, 51, 52, 60, 61, 62, 70, 71, 72, 80, 81, 82) of at least one illumination path (5, 6, 7, 8) for a dark field illumination. The assembly unit (10) furthermore carries plural optical elements (91, 92, 93, 94, 95, 96, 97, 98, 99, 100) of at least one detection path (91, 92). An imaging optical element (32) of the at least one illumination path (3) for the bright field illumination (30), imaging optical elements (51, 61, 71, 81) of the at least one illumination path for the dark field illumination, and imaging optical elements (91, 95, 96) of the at least one detection path (9) are designed in such a way that all illumination paths (3, 5, 6, 7, 8) and all detection paths (91, 92) are telecentric.
摘要:
An illumination device for a DUV microscope has an illumination beam path, proceeding from a DUV light source in which are arranged a condenser and a reflection filter system which generates a DUV wavelength band and comprises four reflection filters. At these, the illumination beam is reflected in each case at the same reflection angle &agr;, the illumination beam path extending coaxially in front of and behind the reflection filter system. According to the present invention, the reflection angle &agr;=30° and the DUV wavelength band &lgr;DUV+&Dgr;&lgr; has a half-value width of max. 20 nm and a peak with a maximum value S of more than 90% of the incoming light intensity. The resulting very narrow half-value width of the DUV wavelength band makes it possible for the DUV objectives of the DUV microscope to be very well-corrected.
摘要:
The present invention relates to an apparatus for illuminating and inspecting a specular surface, comprising a light source, a collector optics for collecting the light from the light source, a homogenizing optics for transmitting the light from the collector optics having a first micro-lens array downstream of the collector optics, and a second micro-lens array downstream of the first micro-lens array, a Fourier optics for transmitting the light from the homogenizing optics onto the specular surface, an objective optics, and a detector for receiving an image, wherein the collector optics and the first micro-lens array project the light source onto the second micro-lens array and wherein the second micro-lens array and the Fourier optics project the first micro-lens array onto the specular surface, and wherein the objective optics projects the specular surface onto the detector.
摘要:
In the production of semiconductor or other components, the structures are normally manufactured in different planes. In the orientation of these planes relative to each other a displacement or alignment is examined, among other things, and detected as an overlay defect. To reduce a systematic measuring defect a measuring device (10) is provided for measuring the overlay defect. This device has an illuminating device (12), a lens or objective (14) for focusing radiation from the illuminating device (12) onto the object (16) and a tube lens (18) for imaging the radiation onto a sensor unit (20). A compensator (22), in which the wave fronts of the incident radiation are tilted with spectral variation such that the axial transverse chromatic aberration is compensated for, is provided in the path of rays of the measuring device (10).
摘要:
A method for focusing an object plane (42) through an objective (30) and an optical assembly (10), with which the method can be carried out, are disclosed. A geometric reference structure (21) is positioned in a plane (36) conjugate to a field plane (34) of the objective (30) and is imaged onto the object plane (42). The geometric reference structure (21) is illuminated with a light beam (24), which encloses a non-zero angle (φ) with a normal direction (38) of the conjugate plane (36). Therefore a position (Y) of an image (22) of the geometric reference structure (21) in the object plane (42) depends on the signed distance (37) between the object plane (42) and the field plane (34), and correspondingly is evaluated for the determination of the focus position. The optical assembly (10) preferentially may be a metrology tool (100) for measuring structures (120) on masks (100), wherein the objective (30) is the measurement objective of the metrology tool (100).
摘要:
A method for focusing an object plane (42) through an objective (30) and an optical assembly (10), with which the method can be carried out, are disclosed. A geometric reference structure (21) is positioned in a plane (36) conjugate to a field plane (34) of the objective (30) and is imaged onto the object plane (42). The geometric reference structure (21) is illuminated with a light beam (24), which encloses a non-zero angle (φ) with a normal direction (38) of the conjugate plane (36). Therefore a position (Y) of an image (22) of the geometric reference structure (21) in the object plane (42) depends on the signed distance (37) between the object plane (42) and the field plane (34), and correspondingly is evaluated for the determination of the focus position. The optical assembly (10) preferentially may be a metrology tool (100) for measuring structures (120) on masks (100), wherein the objective (30) is the measurement objective of the metrology tool (100).
摘要:
An illuminating device, as for a microscope, includes a light source and a reflecting filter system. The beam of light of the light source undergoes a plurality of reflections in the reflecting filter system. The entering beam of the reflecting filter system has an optical beam offset and/or a change in direction relative to the exiting beam.
摘要:
An autofocus module for a microscope-based system includes at least two light sources, each of which generates a light beam for focusing. An optical directing device is provided that directs a respective portion of each light beam onto an incoupling means, which couples each of the light beams into the illuminating light beam of the microscope-based system and directs the light beams onto a specimen. A first and a second detector receive the light beams of the first and second light source reflected from the surface of the specimen, and ascertain the intensities on the first and second detector in time-multiplexed fashion.