发明申请
- 专利标题: PACKAGE STRUCTURE
- 专利标题(中): 包装结构
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申请号: US12759117申请日: 2010-04-13
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公开(公告)号: US20110157851A1公开(公告)日: 2011-06-30
- 发明人: Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
- 申请人: Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
- 申请人地址: TW Taichung
- 专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址: TW Taichung
- 优先权: TW098145249 20091228
- 主分类号: H05K7/02
- IPC分类号: H05K7/02
摘要:
A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.
公开/授权文献
- US08873244B2 Package structure 公开/授权日:2014-10-28