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公开(公告)号：US20080303134A1
公开(公告)日：2008-12-11
申请号：US12156875
申请日：2008-06-05
申请人： Chun-Yuan Li , Hsiao-Jen Hung , Chin-Huang Chang , Jeng-Yuan Lai
发明人： Chun-Yuan Li , Hsiao-Jen Hung , Chin-Huang Chang , Jeng-Yuan Lai
CPC分类号： H01L21/4832 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/27 , H01L24/48 , H01L2224/48091 , H01L2224/73265 , H01L2224/85001 , H01L2224/85444 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K3/341 , H05K3/3436 , H05K2201/0373 , H05K2201/09472 , H05K2201/10727 , H05K2201/10969 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method for fabricating the same are disclosed, which includes: providing a carrier board, forming a plurality of metal bumps on the carrier board, forming a metal layer on the carrier board to encapsulate the metal bumps, having at least one semiconductor chip electrically connected to the metal layer, then forming an encapsulant on the carrier board to encapsulate the semiconductor chip, and next removing the carrier board and the metal bumps to correspondingly form a plurality of grooves on surface of the encapsulant, wherein bottom and sides of the grooves are covered with the metal layer to allow electroconductive components to be effectively positioned in the grooves and completely bonded with the metal layer.
摘要翻译： 公开了一种半导体封装及其制造方法，其包括：提供载体板，在载体板上形成多个金属凸块，在载体板上形成金属层以封装金属凸块，具有至少一个 半导体芯片与金属层电连接，然后在载体板上形成密封剂以封装半导体芯片，接着去除载体板和金属凸块，以在密封剂的表面上相应地形成多个凹槽，其中底部和侧面 的沟槽被金属层覆盖以允许导电部件有效地定位在槽中并与金属层完全粘合。
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公开(公告)号：US20110157851A1
公开(公告)日：2011-06-30
申请号：US12759117
申请日：2010-04-13
申请人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
发明人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
IPC分类号： H05K7/02
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49861 , H01L24/16 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.
摘要翻译： 封装结构包括具有第一密封剂和嵌入第一密封剂并暴露于第一密封剂的布线层的基体。 布线层具有多个导电迹线和多个第一电接触焊盘。 第一密封剂具有用于暴露第一电接触焊盘的开口，与布线层电连接的芯片，以及形成在基体上的用于覆盖芯片和布线层的第二密封剂，从而提供均匀的表面，以防止密封剂 芯片安装时开裂。
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公开(公告)号：US08873244B2
公开(公告)日：2014-10-28
申请号：US12759117
申请日：2010-04-13
申请人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
发明人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49861 , H01L24/16 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.
摘要翻译： 封装结构包括具有第一密封剂和嵌入第一密封剂并暴露于第一密封剂的布线层的基体。 布线层具有多个导电迹线和多个第一电接触焊盘。 第一密封剂具有用于暴露第一电接触焊盘的开口，与布线层电连接的芯片，以及形成在基体上的用于覆盖芯片和布线层的第二密封剂，从而提供均匀的表面，以防止密封剂 芯片安装时开裂。
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公开(公告)号：US07934313B1
公开(公告)日：2011-05-03
申请号：US12759237
申请日：2010-04-13
申请人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
发明人： Pang-Chun Lin , Hsiao-Jen Hung , Chun-Yuan Li , Chien-Ping Huang , Chun-Chi Ke
IPC分类号： H05K3/30
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49861 , H01L24/16 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A fabrication method of a package structure includes: preparing a metal plate having first and second surfaces and defined with an active region; forming a wiring layer with conductive traces and first electrical contact pads on the first surface; forming third electrical contact pads corresponding to the first electrical contact pads on the second surface; forming a first encapsulant on the first surface; forming on the second surface an open area to penetrate the metal plate, wherein the metal plate form conductive posts between the first and third electrical contact pads; mounting in the open area a chip electrically connected to the wiring layer; forming a second encapsulant in the open area, the wiring layer and the third electrical contact pads; forming first and second openings in the first and second encapsulants to expose the third electrical contact pads, respectively; and cutting the metal plate to remove the metal layer.
摘要翻译： 包装结构的制造方法包括：制备具有第一表面和第二表面并且限定有活性区域的金属板; 在所述第一表面上形成具有导电迹线和第一电接触焊盘的布线层; 形成对应于第二表面上的第一电接触焊盘的第三电接触焊盘; 在所述第一表面上形成第一密封剂; 在所述第二表面上形成穿透所述金属板的开放区域，其中所述金属板在所述第一和第三电接触焊盘之间形成导电柱; 在所述开放区域中安装与所述布线层电连接的芯片; 在所述开放区域中形成第二密封剂，所述布线层和所述第三电接触焊盘; 在第一和第二密封剂中形成第一和第二开口以分别露出第三电接触垫; 并切割金属板以去除金属层。
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