发明申请
- 专利标题： PROFILE CONTROL IN INTERCONNECT STRUCTURES
- 专利标题（中）： 互连结构中的配置控制
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申请号： US13562953申请日： 2012-07-31
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公开(公告)号： US20140035142A1公开(公告)日： 2014-02-06
- 发明人: Chih-Chao Yang , Shyng-Tsong Chen , Samuel S. Choi , Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Wai-Kin Li , Christopher J. Penny , Shom Ponoth , Yunpeng Yin
- 申请人： Chih-Chao Yang , Shyng-Tsong Chen , Samuel S. Choi , Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Wai-Kin Li , Christopher J. Penny , Shom Ponoth , Yunpeng Yin
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/28
摘要：
The profile of a via can be controlled by forming a profile control liner within each via opening that is formed into a dielectric material prior to forming a line opening within the dielectric material. The presence of the profile control liner within each via opening during the formation of the line opening prevents rounding of the corners of a dielectric material portion that is present beneath the line opening and adjacent the via opening.
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