Invention Application
- Patent Title: METHOD AND APPARATUS DEPOSITION PROCESS SYNCHRONIZATION
- Patent Title (中): 方法和装置沉积工艺同步
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Application No.: US13570712Application Date: 2012-08-09
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Publication No.: US20140046475A1Publication Date: 2014-02-13
- Inventor: WINSOR LAM , KEITH A. MILLER , CARL JOHNSON , MARTIN LEE RIKER , YE XU
- Applicant: WINSOR LAM , KEITH A. MILLER , CARL JOHNSON , MARTIN LEE RIKER , YE XU
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C14/35
- IPC: C23C14/35 ; C25D21/12 ; G05B15/02 ; C23C14/54

Abstract:
Methods and apparatus for processing a substrate in a process chamber, include receiving process control parameters for one or more devices from a process controller to perform a first chamber process, determining a time to send each of the process control parameters to the one or more devices, for each of the one or more devices, adjusting the determined time to send each of the process control parameters using specific signal process delays associated with each of the one or more devices, and sending the process control parameters to each of the one or more devices at the adjusted times to perform the first chamber process, wherein the synchronization controller includes one or more output channels, each channel directly coupled to one of the one or more devices.
Information query
IPC分类: