Invention Application
- Patent Title: VARIABLE INTERCONNECT PITCH FOR IMPROVED PERFORMANCE
- Patent Title (中): 用于改进性能的可变互连点对点
-
Application No.: US14484137Application Date: 2014-09-11
-
Publication No.: US20150301973A1Publication Date: 2015-10-22
- Inventor: Kern RIM , Stanley Seungchul SONG , Xiangdong CHEN , Raymond George Stephany , John Jianhong ZHU , Ohsang KWON , Esin TERZIOGLU , Choh Fei YEAP
- Applicant: QUALCOMM Incorporated
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42
Abstract:
A method of designing conductive interconnects includes determining a residual spacing value based at least in part on an integer multiple of a interconnect trace pitch and a designated cell height. The method also includes allocating the residual spacing to at least one interconnect trace width or interconnect trace space within the interconnect trace pitch.
Public/Granted literature
- US09984029B2 Variable interconnect pitch for improved performance Public/Granted day:2018-05-29
Information query
