Invention Application
- Patent Title: PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Patent Title (中): 等离子体加工设备和等离子体处理方法
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Application No.: US14818415Application Date: 2015-08-05
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Publication No.: US20160064188A1Publication Date: 2016-03-03
- Inventor: Shogo OKITA , Hiromi ASAKURA , Syouzou WATANABE , Noriyuki MATSUBARA , Mitsuru HIROSHIMA , Toshihiro WADA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Priority: JP2014-172787 20140827
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus that performs plasma processing to a substrate held on a transport carrier including a frame and a holding sheet that covers an opening of the frame includes: a transport mechanism that transports the transport carrier; a position measuring section that measures a position of the substrate to the frame; a plasma processing section that includes a plasma processing stage on which the transport carrier is loaded and a cover that covers the frame and a part of the holding sheet loaded on the plasma processing stage, and has a window section for exposing a part of the substrate; and a control section that controls the transport mechanism such that the transport carrier is loaded on the plasma processing stage to satisfy a positional relationship between the window section and the substrate based on the position information of the substrate to the frame.
Information query