- 专利标题: SUPPORT SUPPLY APPARATUS AND METHOD FOR SUPPLYING SUPPORT
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申请号: US15219930申请日: 2016-07-26
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公开(公告)号: US20160332826A1公开(公告)日: 2016-11-17
- 发明人: Masakatsu OHNO , Kohei YOKOYAMA , Satoru IDOJIRI , Hisao IKEDA , Yasuhiro JINBO , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 优先权: JP2013-179700 20130830; JP2014-029405 20140219
- 主分类号: B65G49/06
- IPC分类号: B65G49/06 ; H01L51/56 ; H01L27/32 ; B65H3/08 ; B32B37/00 ; B65H35/00 ; B65H16/00 ; B32B43/00 ; B32B17/06 ; H01L51/52 ; B65H3/48
摘要:
An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
公开/授权文献
- US10065808B2 Support supply apparatus and method for supplying support 公开/授权日:2018-09-04
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