Invention Application
US20160343805A1 SEMICONDUCTOR DEVICE INCLUDING METAL-2 DIMENSIONAL MATERIAL-SEMICONDUCTOR CONTACT
审中-公开
包含金属二维材料半导体接触器的半导体器件
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING METAL-2 DIMENSIONAL MATERIAL-SEMICONDUCTOR CONTACT
- Patent Title (中): 包含金属二维材料半导体接触器的半导体器件
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Application No.: US15010807Application Date: 2016-01-29
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Publication No.: US20160343805A1Publication Date: 2016-11-24
- Inventor: Minhyun LEE , Haeryong KIM , Hyeonjin SHIN , Seunggeol NAM , Seongjun PARK
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2015-0070567 20150520; KR10-2015-0110233 20150804
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/04 ; H01L29/165 ; H01L29/78 ; H01L29/267
Abstract:
A semiconductor device includes a semiconductor layer, a metal layer electrically contacting the semiconductor layer, and a two-dimensional material layer between the semiconductor layer and the metal layer and having a two-dimensional crystal structure.
Public/Granted literature
- US10217819B2 Semiconductor device including metal-2 dimensional material-semiconductor contact Public/Granted day:2019-02-26
Information query
IPC分类:
