Invention Application
- Patent Title: HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
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Application No.: US15167461Application Date: 2016-05-27
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Publication No.: US20160378711A1Publication Date: 2016-12-29
- Inventor: Venkatraman Iyer , Darren S. Jue , Robert G. Blankenship , Fulvio Spagna , Debendra Das Sharma , Jeffrey C. Swanson
- Applicant: Intel Corporation
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F1/24 ; G06F1/32 ; G06F13/16
Abstract:
A periodic control window is embedded in a link layer data stream to be sent over a serial data link, where the control window is configured to provide physical layer information including information for use in initiating state transitions on the data link. The link layer data can be sent during a link transmitting state of the data link and the control window can interrupt the sending of flits. In one aspect, the information includes link width transition data indicating an attempt to change the number of active lanes on the link.
Public/Granted literature
- US10146733B2 High performance interconnect physical layer Public/Granted day:2018-12-04
Information query
