- 专利标题： MATERIAL THICKNESS DEVICE AND METHOD
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申请号： US14968401申请日： 2015-12-14
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公开(公告)号： US20170170080A1公开(公告)日： 2017-06-15
- 发明人: Darko Grujicic , Nilanjan Ghosh , Marcel A. Wall , Deepak Goyal
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/288 ; H01L21/285 ; C23C14/54 ; H01L21/67 ; C23C18/16 ; C23C14/34 ; H01L21/48 ; H01L21/3213
摘要：
A material thickness adjustment device and associated methods are shown. Material thickness adjustment devices and methods shown include eddy current measurement to determine material thickness during a deposition or removal operation. Feedback from the measured thickness may then be applied to adjust one or more processing parameters to meet a desired thickness.
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