Invention Application
- Patent Title: METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER AND SIC EPITAXIAL GROWTH APPARATUS
-
Application No.: US15534317Application Date: 2015-12-08
-
Publication No.: US20170345658A1Publication Date: 2017-11-30
- Inventor: Keisuke FUKADA , Masahiko ITO , Isaho KAMATA , Hidekazu TSUCHIDA , Hideyuki UEHIGASHI , Hiroaki FUJIBAYASHI , Masami NAITO , Kazukuni HARA , Takahiro KOZAWA , Hirofumi AOKI
- Applicant: SHOWA DENKO K.K. , Central Research Institute of Electric Power Industry
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: SHOWA DENKO K.K.,Central Research Institute of Electric Power Industry
- Current Assignee: SHOWA DENKO K.K.,Central Research Institute of Electric Power Industry
- Current Assignee Address: JP Tokyo JP Tokyo
- Priority: JP2014-257834 20141219
- International Application: PCT/JP2015/084386 WO 20151208
- Main IPC: H01L21/205
- IPC: H01L21/205 ; C30B25/20 ; C30B25/18 ; C30B25/14 ; C23C16/455 ; C30B29/36 ; C23C16/42

Abstract:
A method for manufacturing a SiC epitaxial wafer according to one aspect of the present invention includes separately introducing, into a reaction space for SiC epitaxial growth, a basic N-based gas composed of molecules containing an N atom within the molecular structure but having neither a double bond nor a triple bond between nitrogen atoms, and a Cl-based gas composed of molecules containing a Cl atom within the molecular structure, and mixing the N-based gas and the Cl-based gas at a temperature equal to or higher than the boiling point or sublimation temperature of a solid product generated by mixing the N-based gas and the Cl-based gas.
Public/Granted literature
Information query
IPC分类: