Invention Application
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING CIRCUIT HAVING SECURITY FUNCTION
-
Application No.: US15750614Application Date: 2016-08-03
-
Publication No.: US20190019766A1Publication Date: 2019-01-17
- Inventor: Yohei Hori , Yongxun Liu , Shinichi Ouchi , Tetsuji Yasuda , Meishoku Masahara , Toshifumi Irisawa , Kazuhiko Endo , Hiroyuki Ota , Tatsuro Maeda , Hanpei Koike , Yasuhiro Ogasahara , Toshihiro Katashita , Koichi Fukuda
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Priority: JP2015-158407 20150810
- International Application: PCT/JP2016/072806 WO 20160803
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L23/522
Abstract:
A semiconductor device 100 of the present invention includes a front end and back ends A and B, each including a plurality of layers. Further, in the plurality of layers of the back end B, (i) circuits 22, 23, and 24 having a security function are provided in at least one layer having a wiring pitch of 100 nm or more, (ii) a circuit having a security function is provided in at least one wiring layer in M5 or higher level (M5, M6, M7, . . . ), (iii) a circuit having a security function is provided in at least one layer, for which immersion ArF exposure does not need to be used, or (iv) a circuit having a security function is provided in at least one layer that is exposed by using an exposure wavelength of 200 nm or more.
Information query
IPC分类:
