Invention Application
- Patent Title: POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
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Application No.: US16074994Application Date: 2017-02-08
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Publication No.: US20190062595A1Publication Date: 2019-02-28
- Inventor: Megumi TANIGUCHI , Kohsuke TSUCHIYA , Maki ASADA , Taiki ICHITSUBO , Hisanori TANSHO
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-shi, Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-shi, Aichi
- Priority: JP2016-038199 20160229; JP2016-193688 20160930
- International Application: PCT/JP2017/004621 WO 20170208
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; H01L21/306 ; H01L21/02
Abstract:
The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.
Public/Granted literature
- US11332640B2 Polishing composition and polishing method using same Public/Granted day:2022-05-17
Information query
