公开(公告)号：US20160272846A1

公开(公告)日：2016-09-22

申请号：US14777841

申请日：2014-03-14

申请人： FUJIMI INCORPORATED

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Taiki ICHITSUBO

IPC分类号： C09G1/02 ,  C08F216/06 ,  C09G1/16 ,  H01L21/02

CPC分类号： C09G1/02 ,  C08F216/06 ,  C09G1/16 ,  C09K3/1436 ,  C09K3/1454 ,  H01L21/02024

摘要： Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.

摘要翻译： 本发明提供一种抛光组合物，其包含水溶性聚合物，其具有包含多个具有不同SP值的重复单元种类的分子结构，以及抛光组合物，其通过规定的方法确定时具有规定范围内的蚀刻速率和磨料吸附。 还提供了使用研磨剂，碱性化合物，具有碱性水解官能团的水溶性聚合物和水来制造抛光组合物的方法。 该方法包括获得至少包含碱性化合物的试剂A和获得至少包含水溶性聚合物H的试剂B的步骤。

公开(公告)号：US20230073290A1

公开(公告)日：2023-03-09

申请号：US17870663

申请日：2022-07-21

申请人： FUJIMI INCORPORATED

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Yusuke SUGA ,  Taiki ICHITSUBO ,  Takayuki TAKEMOTO ,  Naohiko SAITO ,  Michihiro KAAI

IPC分类号： C09G1/02 ,  B24B37/04

摘要： Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.

公开(公告)号：US20150376464A1

公开(公告)日：2015-12-31

申请号：US14767494

申请日：2014-02-10

申请人： FUJIMI INCORPORATED

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Maki ASADA ,  Yusuke SUGA

IPC分类号： C09G1/02

CPC分类号： C09G1/02 ,  B24B37/044 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/02052

摘要： The present invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The polishing composition has a volume average particle diameter DA of grains in the polishing composition of 20 nm to 60 nm measured by dynamic light scattering at a concentration equivalent to 0.2% abrasive content by mass.

摘要翻译： 本发明提供一种抛光组合物，其包括研磨剂，水溶性聚合物和水。 抛光组合物的研磨用组合物中的粒径的体积平均粒径DA为20nm〜60nm，通过动态光散射测定，其浓度等于0.2质量％的磨料含量。

公开(公告)号：US20220267644A1

公开(公告)日：2022-08-25

申请号：US17632843

申请日：2020-07-30

申请人： FUJIMI INCORPORATED

发明人： Shinji FURUTA ,  Takashi HAYAKAWA ,  Keiji ASHITAKA ,  Naoya MIWA ,  Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Reiko AKIZUKI

IPC分类号： C09G1/02 ,  B01J20/28 ,  B01D69/02

摘要： Provided is a method for filtering an additive-containing liquid that can achieve a polishing composition exhibiting excellent defect reducing capability while maintaining a practical filter life. The method for filtering a polishing additive-containing liquid provided by the present invention includes the step of: filtering the polishing additive-containing liquid with a filter that satisfies the following conditions (1) and (2). (1) The average pore diameter P measured by a palm porometer is 0.15 μm or less. (2) The pore diameter gradient (Sin/Sout), which is the ratio of the inlet-side average pore diameter (SO to the outlet-side average pore diameter (Sout), both diameters being measured through observation with an SEM, is 3 or less.

公开(公告)号：US20210189177A1

公开(公告)日：2021-06-24

申请号：US16761302

申请日：2018-10-19

申请人： FUJIMI INCORPORATED ,  TOAGOSEI CO., LTD.

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Yusuke SUGA ,  Taiki ICHITSUBO ,  Takayuki TAKEMOTO ,  Naohiko SAITO ,  Michihiro KAAI

IPC分类号： C09G1/02 ,  B24B37/04

摘要： Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.

公开(公告)号：US20160122591A1

公开(公告)日：2016-05-05

申请号：US14895318

申请日：2014-05-02

申请人： FUJIMI INCORPORATED ,  TOAGOSEI CO., LTD.

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Taiki ICHITSUBO ,  Yoshio MORI

IPC分类号： C09G1/02

CPC分类号： C09G1/02 ,  B24B37/00 ,  B24B37/044 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/02052

摘要： This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.

摘要翻译： 本发明提供了在磨料存在下使用的硅晶片抛光组合物。 该组合物包括硅晶片抛光促进剂，含酰胺基聚合物和水。 含酰胺基的聚合物在其主链中具有建筑单元A. 构成单元A包含构成含酰胺基聚合物的主链的主链碳原子和仲酰胺基或叔酰胺基。 构成仲酰胺基或叔酰胺基的羰基碳原子与主链碳原子直接相连。

公开(公告)号：US20230331930A1

公开(公告)日：2023-10-19

申请号：US18028920

申请日：2021-06-09

申请人： FUJIMI INCORPORATED

发明人： Hisanori TANSHO ,  Kohsuke TSUCHIYA ,  Hiroki YAMAGUCHI ,  Reiko AKIZUKI ,  Ryunosuke ANDO

IPC分类号： C08J3/07 ,  C09G1/02

CPC分类号： C08J3/07 ,  C09G1/02 ,  C08J2329/04

摘要： To provide a polyvinyl alcohol composition effectively suppressed in generation of an aggregated product, in a method for producing a wetting agent for a semiconductor, containing a polyvinyl alcohol composition.
A method for producing a wetting agent for a semiconductor, containing a polyvinyl alcohol composition, wherein the polyvinyl alcohol composition is obtained through an addition-in-liquid step of adding into the inside of any one solution of a first liquid containing polyvinyl alcohol and water and a second liquid other than the first liquid, the other liquid of the first liquid and the second liquid.

公开(公告)号：US20190077992A1

公开(公告)日：2019-03-14

申请号：US16185666

申请日：2018-11-09

申请人： FUJIMI INCORPORATED

发明人： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Taiki ICHITSUBO

IPC分类号： C09G1/02 ,  C08F216/06 ,  H01L21/306

摘要： Provided are polishing compositions comprising a water-soluble polymer and water. The water-soluble polymer of an embodiment has a repeat unit that does not have any hydroxyl groups, and the water-soluble polymer has a hydroxyl group content in a range of 4 mmol/g or higher and 21 mmol/g or lower. The water-soluble polymer of another embodiment has a repeat unit A that has a hydroxyl group and a repeat unit B, and the number of moles of the repeat unit B in the total number of moles of all the repeat units of the water-soluble polymer is 5% or greater.

公开(公告)号：US20190062595A1

公开(公告)日：2019-02-28

申请号：US16074994

申请日：2017-02-08

申请人： FUJIMI INCORPORATED

发明人： Megumi TANIGUCHI ,  Kohsuke TSUCHIYA ,  Maki ASADA ,  Taiki ICHITSUBO ,  Hisanori TANSHO

IPC分类号： C09G1/02 ,  B24B37/04 ,  H01L21/306 ,  H01L21/02

摘要： The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.

公开(公告)号：US20190015947A1

公开(公告)日：2019-01-17

申请号：US16070359

申请日：2016-12-16

申请人： FUJIMI INCORPORATED

发明人： Kohsuke TSUCHIYA ,  Taiki ICHITSUBO ,  Hisanori TANSHO ,  Yusuke SUGA

IPC分类号： B24B37/04 ,  H01L21/306 ,  C09G1/02

摘要： To provide a polishing composition capable of realizing a polished surface having smoothness and few defects. A polishing composition contains a water-soluble polymer satisfying the following two conditions (A) and (B): Condition (A): in a first standard solution which contains silica having an average primary particle size of 35 nm, the water-soluble polymer, ammonia, and water and in which the concentration of the silica is 0.48% by mass, the concentration of the water-soluble polymer is 0.0125% by mass, and the pH is 10.0, the adsorption ratio which is a ratio of the amount of the water-soluble polymer adsorbed to the silica to the total amount of the water-soluble polymer contained in the first standard solution is 10% or more; and Condition (B): in a second standard solution which contains silica having an average primary particle size of 35 nm, the water-soluble polymer, ammonia, and water and in which the concentration of the silica is 0.48% by mass, the concentration of the water-soluble polymer is 0.0125% by mass, and the pH is 10.4, the adsorption ratio which is a ratio of the amount of the water-soluble polymer adsorbed to the silica to the total amount of the water-soluble polymer contained in the second standard solution is 65% or less.