- 专利标题： METHOD FOR PROCESSING WORKPIECE
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申请号： US16322863申请日： 2017-08-01
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公开(公告)号： US20190189493A1公开(公告)日： 2019-06-20
- 发明人: Shuhei OGAWA , Keigo TOYODA , Yoshihide KIHARA
- 申请人： TOKYO ELECTRON LIMITED
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2016-154663 20160805
- 国际申请： PCT/JP2017/027888 WO 20170801
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/3065 ; H01L21/308 ; H01L21/311 ; H01L21/67 ; H01J37/32
摘要：
A method according to an embodiment includes: (a) a first step of etching a workpiece held by a holding structure in a state in which a first direction and a second direction are maintained to form a first angle, by a plasma generated in a processing container; and (a) a second step of, after execution of the first step, etching the workpiece held by the holding structure in a state in which the first direction and the second direction are maintained to form a second angle, by the plasma generated in the processing container.
公开/授权文献
- US11056370B2 Method for processing workpiece 公开/授权日：2021-07-06