Invention Application
- Patent Title: NANOWIRE STRUCTURES HAVING WRAP-AROUND CONTACTS
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Application No.: US17072992Application Date: 2020-10-16
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Publication No.: US20210036137A1Publication Date: 2021-02-04
- Inventor: Stephen M. CEA , Cory E. WEBER , Patrick H. KEYS , Seiyon KIM , Michael G. HAVERTY , Sadasivan SHANKAR
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/775
- IPC: H01L29/775 ; H01L29/66 ; B82Y10/00 ; H01L29/06 ; H01L29/417 ; H01L29/786 ; H01L29/78

Abstract:
Nanowire structures having wrap-around contacts are described. For example, a nanowire semiconductor device includes a nanowire disposed above a substrate. A channel region is disposed in the nanowire. The channel region has a length and a perimeter orthogonal to the length. A gate electrode stack surrounds the entire perimeter of the channel region. A pair of source and drain regions is disposed in the nanowire, on either side of the channel region. Each of the source and drain regions has a perimeter orthogonal to the length of the channel region. A first contact completely surrounds the perimeter of the source region. A second contact completely surrounds the perimeter of the drain region.
Public/Granted literature
- US11757026B2 Nanowire structures having wrap-around contacts Public/Granted day:2023-09-12
Information query
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