- 专利标题： DIRECTLY IMPINGING PRESSURE MODULATED SPRAY COOLING AND METHODS OF TARGET TEMPERATURE CONTROL
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申请号： US16871424申请日： 2020-05-11
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公开(公告)号： US20210351106A1公开(公告)日： 2021-11-11
- 发明人: Prabhakar SUBRAHMANYAM , Tewodros WONDIMU , Ying-Feng PANG , Muhammad AHMAD , Paul DIGLIO , David SHIA , Pooya TADAYON
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/427
- IPC分类号： H01L23/427 ; G01R31/26 ; B05B1/14
摘要：
Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.
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