公开(公告)号：US20230260870A1

公开(公告)日：2023-08-17

申请号：US18137987

申请日：2023-04-21

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC分类号： H01L23/427 ,  B05B1/14 ,  G01R31/26

CPC分类号： H01L23/427 ,  B05B1/14 ,  G01R31/2642

摘要： Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20220117112A1

公开(公告)日：2022-04-14

申请号：US17068333

申请日：2020-10-12

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Ying-Feng PANG ,  Yi XIA ,  Muhammad AHMAD

IPC分类号： H05K7/20 ,  H01L23/367

摘要： Embodiments disclosed herein include heatsinks with transpiration cooling features. In an embodiment, a heatsink comprises a body with a first surface, a second surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, a first hole is formed into the first surface, where the first hole terminates before reaching the second surface. In an embodiment, the heatsink further comprises a second hole into the sidewall surface, where the second hole intersects the first hole.

公开(公告)号：US20210351106A1

公开(公告)日：2021-11-11

申请号：US16871424

申请日：2020-05-11

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC分类号： H01L23/427 ,  G01R31/26 ,  B05B1/14

摘要： Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20210120703A1

公开(公告)日：2021-04-22

申请号：US17134368

申请日：2020-12-26

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Arun KRISHNAMOORTHY ,  Victor POLYANKO ,  Ying-Feng PANG ,  Yi XIA ,  Pooya TADAYON ,  Muhammad AHMAD ,  Rahima K. MOHAMMED

IPC分类号： H05K7/20

摘要： An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption