Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS
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Application No.: US17495833Application Date: 2021-10-07
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Publication No.: US20220115249A1Publication Date: 2022-04-14
- Inventor: Nobuhiro OGATA , Hiroki SAKURAI , Daisuke GOTO , Takahiro KOGA , Kanta MORI , Yusuke HASHIMOTO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2020-171134 20201009,JP2021-149079 20210914
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B05B1/14

Abstract:
A substrate processing apparatus includes a fluid supply unit that supplies a fluid that includes a pressurized vapor or mist of a purified water, a processing liquid supply unit that supplies a processing liquid that includes at least sulfuric acid, and a nozzle that includes a first discharge port that discharges a fluid that is supplied from the fluid supply unit, a second discharge port that discharges a processing liquid that is supplied from the processing liquid supply unit, and a guiding route that is communicated with the first discharge port and the second discharge port and guides a mixed fluid of a fluid that is discharged from the first discharge port and a processing liquid that is discharged from the second discharge port, where a cross-sectional area of the guiding route is greater than a cross-sectional area of the first discharge port.
Public/Granted literature
- US12051605B2 Substrate processing apparatus Public/Granted day:2024-07-30
Information query
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