公开(公告)号：US20240124984A1

公开(公告)日：2024-04-18

申请号：US18483608

申请日：2023-10-10

Applicant: Tokyo Electron Limited

Inventor： Yusuke HASHIMOTO ,  Daisuke GOTO ,  Nobuhiro OGATA ,  Jiro HIGASHIJIMA ,  Tomoaki OBARU ,  Kanta MORI

IPC: C23F1/08

CPC classification number: C23F1/08 ,  H01L21/67023

Abstract: A substrate processing apparatus that supplies a processing liquid to a front surface of a substrate which is rotating, includes: a substrate holder configured to hold the substrate, wherein the substrate holder includes: a gripper configured to come into contact with a periphery of the substrate to grip the substrate; and a base to which the gripper is attached.

公开(公告)号：US20230185199A1

公开(公告)日：2023-06-15

申请号：US18077577

申请日：2022-12-08

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Nobuhiro OGATA ,  Daisuke GOTO ,  Kanta MORI ,  Kenji YADA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: G03F7/30 ,  G03F7/42

CPC classification number: G03F7/3021 ,  G03F7/426

Abstract: A nozzle that mixes fluid containing steam or mist of pressurized pure water and processing liquid containing at least sulfuric acid and ejects mixed fluid of the fluid and the processing liquid, the nozzle comprising: at least one first ejection port ejecting the fluid; at least one second ejection port ejecting the processing liquid; and at least one lead-out path being in fluid communication with the at least one first ejection port and the at least one second ejection port and leading out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port, wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to position deviated from central axis of the at least one lead-out path in a plan view.

公开(公告)号：US20220115249A1

公开(公告)日：2022-04-14

申请号：US17495833

申请日：2021-10-07

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro OGATA ,  Hiroki SAKURAI ,  Daisuke GOTO ,  Takahiro KOGA ,  Kanta MORI ,  Yusuke HASHIMOTO

IPC: H01L21/67 ,  B05B1/14

Abstract: A substrate processing apparatus includes a fluid supply unit that supplies a fluid that includes a pressurized vapor or mist of a purified water, a processing liquid supply unit that supplies a processing liquid that includes at least sulfuric acid, and a nozzle that includes a first discharge port that discharges a fluid that is supplied from the fluid supply unit, a second discharge port that discharges a processing liquid that is supplied from the processing liquid supply unit, and a guiding route that is communicated with the first discharge port and the second discharge port and guides a mixed fluid of a fluid that is discharged from the first discharge port and a processing liquid that is discharged from the second discharge port, where a cross-sectional area of the guiding route is greater than a cross-sectional area of the first discharge port.