公开(公告)号：US20230185199A1

公开(公告)日：2023-06-15

申请号：US18077577

申请日：2022-12-08

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Nobuhiro OGATA ,  Daisuke GOTO ,  Kanta MORI ,  Kenji YADA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: G03F7/30 ,  G03F7/42

CPC classification number: G03F7/3021 ,  G03F7/426

Abstract: A nozzle that mixes fluid containing steam or mist of pressurized pure water and processing liquid containing at least sulfuric acid and ejects mixed fluid of the fluid and the processing liquid, the nozzle comprising: at least one first ejection port ejecting the fluid; at least one second ejection port ejecting the processing liquid; and at least one lead-out path being in fluid communication with the at least one first ejection port and the at least one second ejection port and leading out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port, wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to position deviated from central axis of the at least one lead-out path in a plan view.

公开(公告)号：US20220115249A1

公开(公告)日：2022-04-14

申请号：US17495833

申请日：2021-10-07

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro OGATA ,  Hiroki SAKURAI ,  Daisuke GOTO ,  Takahiro KOGA ,  Kanta MORI ,  Yusuke HASHIMOTO

IPC: H01L21/67 ,  B05B1/14

Abstract: A substrate processing apparatus includes a fluid supply unit that supplies a fluid that includes a pressurized vapor or mist of a purified water, a processing liquid supply unit that supplies a processing liquid that includes at least sulfuric acid, and a nozzle that includes a first discharge port that discharges a fluid that is supplied from the fluid supply unit, a second discharge port that discharges a processing liquid that is supplied from the processing liquid supply unit, and a guiding route that is communicated with the first discharge port and the second discharge port and guides a mixed fluid of a fluid that is discharged from the first discharge port and a processing liquid that is discharged from the second discharge port, where a cross-sectional area of the guiding route is greater than a cross-sectional area of the first discharge port.

公开(公告)号：US20210210363A1

公开(公告)日：2021-07-08

申请号：US17141670

申请日：2021-01-05

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Daisuke GOTO ,  Takashi NAKAZAWA ,  Yusuke TAKAMATSU ,  Yusuke HASHIMOTO

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10

Abstract: A substrate processing apparatus includes: a temperature raising part for raising a temperature of a first sulfuric acid; a mixing part for mixing the first sulfuric acid where the temperature is raised by the temperature raising part with a moisture-containing liquid to generate a mixed solution; and a discharging part for discharging the mixed solution onto a substrate inside a substrate processing part. The mixing part includes: a joining portion where a sulfuric acid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part flows and a liquid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part and the moisture-containing liquid flows are joined; and a reaction suppression mechanism for suppressing a reaction between the first sulfuric acid and the moisture-containing liquid in the joining portion.

公开(公告)号：US20240157408A1

公开(公告)日：2024-05-16

申请号：US18386802

申请日：2023-11-03

Applicant: Tokyo Electron Limited

Inventor： Daisuke GOTO ,  Jiro HIGASHIJIMA ,  Nobuhiro OGATA ,  Yusuke HASHIMOTO

IPC: B08B3/02 ,  B08B5/02

CPC classification number: B08B3/022 ,  B08B5/02 ,  B08B2203/02

Abstract: A substrate processing apparatus includes a substrate holding unit, a rotation driving unit, a first rotational ring, a second rotational ring, and a first nozzle. The substrate holding unit includes a base plate and a plurality of gripping units that grips a peripheral edge of a substrate, and horizontally holds the substrate spaced apart from the base plate by the gripping units. The rotation driving unit rotates the substrate holding unit. The first rotational ring surrounds a peripheral edge of a lower surface of the substrate and rotates together with the substrate holding unit. The second rotational ring is provided outside the first rotational ring, surrounds a peripheral edge of an upper surface of the substrate, and rotates together with the substrate holding unit. The first nozzle ejects a cleaning liquid from above an entrance of a rotational flow path toward the entrance of the rotational flow path.

公开(公告)号：US20220112603A1

公开(公告)日：2022-04-14

申请号：US17495837

申请日：2021-10-07

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Daisuke GOTO ,  Nobuhiro OGATA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: C23C18/18 ,  C23C18/16

Abstract: A substrate processing method includes discharging a processing liquid to a substrate, and discharging a mixed fluid that is produced by mixing a processing liquid and a purified water in a vapor state or a mist state thereof to a substrate where a processing liquid is discharged.

公开(公告)号：US20240124984A1

公开(公告)日：2024-04-18

申请号：US18483608

申请日：2023-10-10

Applicant: Tokyo Electron Limited

Inventor： Yusuke HASHIMOTO ,  Daisuke GOTO ,  Nobuhiro OGATA ,  Jiro HIGASHIJIMA ,  Tomoaki OBARU ,  Kanta MORI

IPC: C23F1/08

CPC classification number: C23F1/08 ,  H01L21/67023

Abstract: A substrate processing apparatus that supplies a processing liquid to a front surface of a substrate which is rotating, includes: a substrate holder configured to hold the substrate, wherein the substrate holder includes: a gripper configured to come into contact with a periphery of the substrate to grip the substrate; and a base to which the gripper is attached.

公开(公告)号：US20220371041A1

公开(公告)日：2022-11-24

申请号：US17763371

申请日：2020-09-14

Applicant: Tokyo Electron Limited

Inventor： Daisuke GOTO ,  Katsuhiro MORIKAWA ,  Takahiro KOGA

IPC: B05B17/06 ,  B08B3/02 ,  B08B3/12 ,  B08B3/08 ,  B08B5/04 ,  B08B5/02 ,  B08B13/00

Abstract: A processing liquid nozzle according to an aspect of the present invention comprises an ultrasonic application part (60), a first supply flow path (71), a discharge flow path (72), and a second supply flow path (73). The ultrasonic application part (60) has a vibrator (61) for generating ultrasonic waves, and a vibrating body (62) joined to the vibrator (61). The first supply flow path (71) supplies a first liquid (L1) to a position contacting the vibrating body (62) of the ultrasonic application part (60). The discharge flow path (72) supplies the first liquid (L1), to which ultrasonic waves have been applied by the ultrasonic application part (60), to a discharge port (74). The second supply flow path (73) is connected to the discharge flow path (72) on the downstream side from the ultrasonic application part (60), and supplies a second liquid (L2) to the discharge flow path (72).