公开(公告)号：US20240021445A1

公开(公告)日：2024-01-18

申请号：US18215184

申请日：2023-06-28

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Yenrui HSU ,  Shoki MIZUGUCHI ,  Nobuhiro OGATA ,  Shinichi UMENO ,  Kazuya GODA ,  Minsung KIM ,  Hiroyuki HIGASHI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/02057

Abstract: A substrate processing apparatus according to the present disclosure includes a substrate holding unit, a fluid supplying unit, a processing-liquid supplying unit, a nozzle, a fluid amount adjusting unit, and a controller. The substrate holding unit holds a substrate to be rotatable. The fluid supplying unit supplies fluid including pressurized vapor or mist of deionized water. The processing-liquid supplying unit supplies processing liquid including at least a sulfuric acid. The nozzle is connected to the fluid supplying unit and the processing-liquid supplying unit to discharge mixed fluid of the fluid and the processing liquid toward the substrate. The fluid amount adjusting unit adjusts a flow volume of the fluid that is flowing through the fluid supplying unit. The controller controls the fluid amount adjusting unit to adjust a ratio of the fluid to the processing liquid.

公开(公告)号：US20230185199A1

公开(公告)日：2023-06-15

申请号：US18077577

申请日：2022-12-08

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Nobuhiro OGATA ,  Daisuke GOTO ,  Kanta MORI ,  Kenji YADA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: G03F7/30 ,  G03F7/42

CPC classification number: G03F7/3021 ,  G03F7/426

Abstract: A nozzle that mixes fluid containing steam or mist of pressurized pure water and processing liquid containing at least sulfuric acid and ejects mixed fluid of the fluid and the processing liquid, the nozzle comprising: at least one first ejection port ejecting the fluid; at least one second ejection port ejecting the processing liquid; and at least one lead-out path being in fluid communication with the at least one first ejection port and the at least one second ejection port and leading out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port, wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to position deviated from central axis of the at least one lead-out path in a plan view.

公开(公告)号：US20220115249A1

公开(公告)日：2022-04-14

申请号：US17495833

申请日：2021-10-07

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro OGATA ,  Hiroki SAKURAI ,  Daisuke GOTO ,  Takahiro KOGA ,  Kanta MORI ,  Yusuke HASHIMOTO

IPC: H01L21/67 ,  B05B1/14

Abstract: A substrate processing apparatus includes a fluid supply unit that supplies a fluid that includes a pressurized vapor or mist of a purified water, a processing liquid supply unit that supplies a processing liquid that includes at least sulfuric acid, and a nozzle that includes a first discharge port that discharges a fluid that is supplied from the fluid supply unit, a second discharge port that discharges a processing liquid that is supplied from the processing liquid supply unit, and a guiding route that is communicated with the first discharge port and the second discharge port and guides a mixed fluid of a fluid that is discharged from the first discharge port and a processing liquid that is discharged from the second discharge port, where a cross-sectional area of the guiding route is greater than a cross-sectional area of the first discharge port.

公开(公告)号：US20240124984A1

公开(公告)日：2024-04-18

申请号：US18483608

申请日：2023-10-10

Applicant: Tokyo Electron Limited

Inventor： Yusuke HASHIMOTO ,  Daisuke GOTO ,  Nobuhiro OGATA ,  Jiro HIGASHIJIMA ,  Tomoaki OBARU ,  Kanta MORI

IPC: C23F1/08

CPC classification number: C23F1/08 ,  H01L21/67023

Abstract: A substrate processing apparatus that supplies a processing liquid to a front surface of a substrate which is rotating, includes: a substrate holder configured to hold the substrate, wherein the substrate holder includes: a gripper configured to come into contact with a periphery of the substrate to grip the substrate; and a base to which the gripper is attached.

公开(公告)号：US20200070196A1

公开(公告)日：2020-03-05

申请号：US16553984

申请日：2019-08-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Fumihiro KAMIMURA ,  Hiroshi KOMIYA ,  Nobuhiro OGATA ,  Takahisa OTSUKA

IPC: B05B15/58 ,  B05D1/02 ,  H01L21/67 ,  B05B12/08

Abstract: There is provided a substrate processing apparatus including: a nozzle configured to eject a processing liquid onto a substrate; a standby section having an opening, wherein the nozzle is inserted into the opening to stand by in the standby section; a supply path through which the processing liquid is supplied to the nozzle; a discharge path through which the processing liquid is discharged from the standby section; a circulation path formed by connecting the nozzle, the standby section, the supply path, and the discharge path; and an atmospheric-blocking mechanism provided in the circulation path to block an inside of the circulation path and a surrounding of the substrate from each other.

公开(公告)号：US20200038897A1

公开(公告)日：2020-02-06

申请号：US16528757

申请日：2019-08-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Fumihiro KAMIMURA ,  Takahisa OTSUKA ,  Hiroshi KOMIYA ,  Nobuhiro OGATA

IPC: B05B14/30 ,  H01L21/67 ,  B05B1/30

Abstract: A substrate processing apparatus includes: a processing chamber in which a substrate is processed with a processing liquid; a nozzle having a discharge port from which the processing liquid is discharged, the discharge port being formed in a distal end portion of the nozzle; a nozzle bath including an accommodation chamber formed therein, wherein the distal end portion of the nozzle is accommodated in the accommodation chamber at a standby time at which the processing liquid is not supplied to the substrate; a circulation line configured to return the processing liquid, which is discharged from the nozzle to the nozzle bath, to the nozzle; and a first restraint part configured to restrain a gas from flowing between an outside of the nozzle bath and the processing liquid present inside the nozzle bath when the processing liquid discharged from the nozzle to the nozzle bath is circulated to the nozzle.

公开(公告)号：US20240157408A1

公开(公告)日：2024-05-16

申请号：US18386802

申请日：2023-11-03

Applicant: Tokyo Electron Limited

Inventor： Daisuke GOTO ,  Jiro HIGASHIJIMA ,  Nobuhiro OGATA ,  Yusuke HASHIMOTO

IPC: B08B3/02 ,  B08B5/02

CPC classification number: B08B3/022 ,  B08B5/02 ,  B08B2203/02

Abstract: A substrate processing apparatus includes a substrate holding unit, a rotation driving unit, a first rotational ring, a second rotational ring, and a first nozzle. The substrate holding unit includes a base plate and a plurality of gripping units that grips a peripheral edge of a substrate, and horizontally holds the substrate spaced apart from the base plate by the gripping units. The rotation driving unit rotates the substrate holding unit. The first rotational ring surrounds a peripheral edge of a lower surface of the substrate and rotates together with the substrate holding unit. The second rotational ring is provided outside the first rotational ring, surrounds a peripheral edge of an upper surface of the substrate, and rotates together with the substrate holding unit. The first nozzle ejects a cleaning liquid from above an entrance of a rotational flow path toward the entrance of the rotational flow path.

公开(公告)号：US20220112603A1

公开(公告)日：2022-04-14

申请号：US17495837

申请日：2021-10-07

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Daisuke GOTO ,  Nobuhiro OGATA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: C23C18/18 ,  C23C18/16

Abstract: A substrate processing method includes discharging a processing liquid to a substrate, and discharging a mixed fluid that is produced by mixing a processing liquid and a purified water in a vapor state or a mist state thereof to a substrate where a processing liquid is discharged.

公开(公告)号：US20210365054A1

公开(公告)日：2021-11-25

申请号：US17320733

申请日：2021-05-14

Applicant: Tokyo Electron Limited

Inventor： Mikio NAKASHIMA ,  Akinori TANAKA ,  Nobuhiro OGATA ,  Isamu MIYAMOTO

IPC: G05D7/06

Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.