Invention Application
- Patent Title: ETCHING TO REDUCE LINE WIGGLING
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Application No.: US17586412Application Date: 2022-01-27
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Publication No.: US20220148918A1Publication Date: 2022-05-12
- Inventor: Kuan-Wei Huang , Cheng-Li Fan , Yu-Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/535 ; H01L21/033 ; H01L23/522 ; H01L23/532 ; H01L21/311

Abstract:
A method for reducing wiggling in a line includes forming a first patterning layer over a metal feature and depositing a first mask layer over the first patterning layer. The first mask layer is patterned to form a first set of one or more openings therein and then thinned. The pattern of the first mask layer is transferred to the first patterning layer to form a second set of one or more openings therein. The first patterning layer is etched to widen the second set of one or more openings. The first patterning layer may be comprised of silicon or an oxide material. The openings in the first patterning layer may be widened while a mask layer is over the first patterning layer.
Information query
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