• 专利标题: METHOD OF POLISHING OBJECT TO BE POLISHED CONTAINING MATERIAL HAVING SILICON-SILICON BOND
  • 申请号: US17441587
    申请日: 2020-01-30
  • 公开(公告)号: US20220186077A1
    公开(公告)日: 2022-06-16
  • 发明人: Kohsuke TSUCHIYAMaki ASADASatoshi MOMOTA
  • 申请人: FUJIMI INCORPORATED
  • 申请人地址: JP Kiyosu-shi, Aichi
  • 专利权人: FUJIMI INCORPORATED
  • 当前专利权人: FUJIMI INCORPORATED
  • 当前专利权人地址: JP Kiyosu-shi, Aichi
  • 优先权: JP2019-061177 20190327,JP2019-061187 20190327
  • 国际申请: PCT/JP2020/003548 WO 20200130
  • 主分类号: C09G1/02
  • IPC分类号: C09G1/02 H01L21/306
METHOD OF POLISHING OBJECT TO BE POLISHED CONTAINING MATERIAL HAVING SILICON-SILICON BOND
摘要:
The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step Pf. In this polishing method, the final polishing step Pf has a plurality of polishing sub-steps, the plurality of polishing sub-steps are continuously performed on the same polishing platen, a final polishing sub-step in the plurality of polishing sub-steps is a polishing sub-step Pff of polishing using a polishing composition Sff, a polishing sub-step provided before the polishing sub-step Pff in the plurality of polishing sub-steps is a polishing sub-step Pfp of polishing using a polishing composition Sfp, and the polishing composition Sff satisfies at least one of the following condition (A) or the following condition (B): condition (A): a value of a haze parameter of the polishing composition Sff obtained in a standard test 1 is smaller than a value of the haze parameter of the polishing composition Sfp obtained in the standard test 1, and condition (B): the polishing composition Sff contains an abrasive Aff, a basic compound Bff, and hydroxyethyl cellulose.
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