Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND ABNORMALITY DETECTION METHOD
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Application No.: US17652332Application Date: 2022-02-24
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Publication No.: US20220285182A1Publication Date: 2022-09-08
- Inventor: Hiroaki CHIHAYA , Tetsuya MIYASHITA , Einstein Noel ABARRA , Yasuhiko KOJIMA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2021-036649 20210308
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683
Abstract:
A substrate processing apparatus includes: a stage having an electrostatic chuck configured to attract a substrate; a measurement part configured to measure a temperature of the stage; and a detection part configured to detect an abnormality caused by attraction of the substrate by the electrostatic chuck, based on a fluctuation of the temperature of the stage.
Information query
IPC分类:
