-
公开(公告)号：US20220025511A1
公开(公告)日：2022-01-27
申请号：US17384058
申请日：2021-07-23
Applicant: TOKYO ELECTRON LIMITED
Inventor： Masato SHINADA , Einstein Noel ABARRA , Hiroyuki TOSHIMA , Shota ISHIBASHI
Abstract: An apparatus for performing a sputtering process on a substrate is provided. The apparatus includes a processing chamber having a substrate support on which the substrate is placed, a target for emitting target particles to be adhered to the substrate by plasma formed in the processing chamber, a magnet, provided on a rear surface of the target, for adjusting a state of the plasma on the surface of the target, and a magnet moving mechanism for repeatedly moving the magnet between a position on one side and a position on the other side set across a center portion on the rear surface of the target. The apparatus further includes a collimator having two regulating plates for limiting an incident angle of the target particles to the substrate, and an arrangement position adjustment mechanism adjusting positions of the two regulating plates according to the movement of the magnet.
-
公开(公告)号：US20210118653A1
公开(公告)日：2021-04-22
申请号：US17050093
申请日：2019-03-20
Applicant: Tokyo Electron Limited
Inventor： Masato SHINADA , Hiroyuki TOSHIMA , Einstein Noel ABARRA
Abstract: A film formation device includes a target holder configured to hold a target for emitting sputtering particles in a processing space inside a processing chamber, a sputtering particle emitting part configured to emit the sputtering particles from the target, a sputtering particle shielding plate having a passage hole through which the emitted sputtering particles pass, a shielding member provided to shield the passage hole, a movement mechanism configured to move the shielding member in the horizontal direction, and a controller. The controller controls the shielding member, which has the placement portion on which a substrate is placed, to be moved in one direction of the horizontal direction, and controls the sputtering particles to be emitted from the target. The sputtering particles passed through the passage hole are deposited on the substrate.
-
3.发明申请公开(公告)号：US20220236202A1
公开(公告)日：2022-07-28
申请号：US17575018
申请日：2022-01-13
Applicant: TOKYO ELECTRON LIMITED
Inventor： Einstein Noel ABARRA , Hiroaki CHIHAYA
Abstract: A holder temperature detection method which measures a temperature of a rotatable holder that holds a substrate is provided. The method comprises a step of irradiating a fluorescent body thermally mounted on the holder with a light pulse having a first wavelength, a step of detecting fluorescence having a second wavelength emitted from the fluorescent body due to the light pulse and a step of estimating the temperature of the holder based on the detected fluorescence.
-
4.发明申请公开(公告)号：US20210082777A1
公开(公告)日：2021-03-18
申请号：US17021846
申请日：2020-09-15
Applicant: TOKYO ELECTRON LIMITED
Inventor： Hiroaki CHIHAYA , Einstein Noel ABARRA , Shota ISHIBASHI
IPC: H01L21/66 , H01L43/12 , C23C14/56 , G01N27/72 , G01R33/032
Abstract: A film forming system for forming a magnetic film is provided. The film forming system includes a processing module configured to form the magnetic film on a substrate, a magnetization characteristic measuring device configured to measure magnetization characteristics of the magnetic film formed on the substrate in the processing module, and a transfer unit configured to transfer the substrate between the processing module and the magnetization characteristic measuring device. The magnetization characteristic measuring device includes a magnetic field applying mechanism having a permanent magnet magnetic circuit configured to apply a magnetic field to the substrate and adjust the magnetic field to be applied to the substrate, and a detector configured to detect magnetization characteristics of the substrate.
-
公开(公告)号：US20220285197A1
公开(公告)日：2022-09-08
申请号：US17652545
申请日：2022-02-25
Applicant: Tokyo Electron Limited
Inventor： Hiroaki CHIHAYA , Yasuhiko KOJIMA , Einstein Noel ABARRA , Tetsuya MIYASHITA
IPC: H01L21/683
Abstract: A substrate processing apparatus includes: a stage including an electrostatic chuck configured to attract a substrate; a heater configured to heat the stage; a heating drive part configured to supply power to the heater so that a temperature of the stage becomes a target value; and a detector configured to detect an abnormality in attraction of the substrate by the electrostatic chuck, wherein the detector is further configured to detect the abnormality based on fluctuation of the power supplied to the heater, the fluctuation being generated by the attraction of the substrate by the electrostatic chuck.
-
Patent Agency Ranking
公开(公告)号：US20220285182A1
公开(公告)日：2022-09-08
申请号：US17652332
申请日：2022-02-24
Applicant: Tokyo Electron Limited
Inventor： Hiroaki CHIHAYA , Tetsuya MIYASHITA , Einstein Noel ABARRA , Yasuhiko KOJIMA
IPC: H01L21/67 , H01L21/683
Abstract: A substrate processing apparatus includes: a stage having an electrostatic chuck configured to attract a substrate; a measurement part configured to measure a temperature of the stage; and a detection part configured to detect an abnormality caused by attraction of the substrate by the electrostatic chuck, based on a fluctuation of the temperature of the stage.
-
公开(公告)号：US20220208534A1
公开(公告)日：2022-06-30
申请号：US17556025
申请日：2021-12-20
Applicant: TOKYO ELECTRON LIMITED
Inventor： Masato SHINADA , Tetsuya MIYASHITA , Einstein Noel ABARRA
Abstract: There is provided a sputtering apparatus comprising: a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in one direction; and a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass. The shielding member includes a first shielding member and a second shielding member disposed in a vertical direction.
-
公开(公告)号：US20210285096A1
公开(公告)日：2021-09-16
申请号：US17184089
申请日：2021-02-24
Applicant: Tokyo Electron Limited
Inventor： Masato SHINADA , Tamaki TAKEYAMA , Kazunaga ONO , Naoyuki SUZUKI , Hiroaki CHIHAYA , Einstein Noel ABARRA
Abstract: A film thickness measurement apparatus includes: a stage that places a substrate having a film formed thereon and measures a thickness of the film in-situ in a film forming apparatus; a film thickness meter including a light emitter that emits light toward the substrate disposed on the stage and a light receiving sensor that receives the light reflected by the substrate for measuring the thickness of the film in-situ; a moving mechanism including a multi-joint arm that moves an irradiation point of the light on the substrate; a distance meter that measures a distance between the light receiving sensor and the irradiation point on the substrate; and a distance adjustor that adjusts the distance between the light receiving sensor and the irradiation point on the substrate.
-
公开(公告)号：US20210257198A1
公开(公告)日：2021-08-19
申请号：US17172327
申请日：2021-02-10
Applicant: Tokyo Electron Limited
Inventor： Masato SHINADA , Einstein Noel ABARRA
Abstract: A cathode unit for performing a sputtering film formation includes: a target that emits sputtering particles; a target cooler that includes a cooling plate to which the target is bonded; and a power supply that supplies a power to the target. The target has a high-temperature region that has a higher temperature than other regions of the target during a film formation. The cooling plate includes a coolant flow space through which a coolant flows, and a first wall and a second wall that define the coolant flow space in a thickness direction. In the coolant flow space, a flow path of the coolant is formed by a first partition plate and a second partition plate. The first partition plate does not exist at a portion of the coolant flow space that corresponds to the high-temperature region.
-
公开(公告)号：US20210020419A1
公开(公告)日：2021-01-21
申请号：US16929347
申请日：2020-07-15
Applicant: Tokyo Electron Limited
Inventor： Einstein Noel ABARRA
IPC: H01J37/34
Abstract: A target structure includes a target, a cooling jacket having a flow path through which a heat exchange medium flows, and a backing plate. The target is bonded to one surface of the cooling jacket. A remaining surface of the cooling jacket and the backing plate are bonded in a peripheral portion, and are not bonded in a non-bonding region inside the peripheral portion.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.017 seconds)
