Invention Application
- Patent Title: FUSION MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
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Application No.: US17883682Application Date: 2022-08-09
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Publication No.: US20220384410A1Publication Date: 2022-12-01
- Inventor: HYUNMOG PARK , DAEHYUN KIM , JINMIN KIM , HEI SEUNG KIM , HYUNSIK PARK , SANGKIL LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0167111 20181221
- Main IPC: H01L25/18
- IPC: H01L25/18 ; G11C14/00 ; G11C16/04 ; H01L25/00 ; H01L27/11556 ; H01L27/11582 ; H01L23/522 ; H01L23/48

Abstract:
Disclosed are fusion memory devices and methods of fabricating the same. The fusion memory device comprises a first memory device including a first substrate having active and inactive surfaces opposite to each other and a first memory cell circuit on the active surface of the first substrate, a non-memory device including a second substrate having active and inactive surfaces opposite to each other and a non-memory circuit on the active surface of the second substrate, the non-memory device being provided on the first memory device, and a second memory device on the inactive surface of the second substrate and including a second memory cell circuit different from the first memory cell circuit. The non-memory device lies between the first and second memory cell circuits and controls an electrical operation of each of the first and second memory cell circuits.
Public/Granted literature
- US12119336B2 Fusion memory device and method of fabricating the same Public/Granted day:2024-10-15
Information query
IPC分类: