Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Application No.: US17933983Application Date: 2022-09-21
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Publication No.: US20230014665A1Publication Date: 2023-01-19
- Inventor: Kimio Motoda , Norifumi Kohama , Norio Wada , Yosuke Omori , Kenji Sugakawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2018-008891 20180123
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/68 ; H01L21/683 ; H01L21/687
Abstract:
A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.
Information query
IPC分类:
