公开(公告)号：US20240282617A1

公开(公告)日：2024-08-22

申请号：US18442522

申请日：2024-02-15

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Kenji Sugakawa ,  Norifumi Kohama ,  Hideyuki Fukushima ,  Shintaro Sugihara ,  Norio Wada

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68785

Abstract: A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.

公开(公告)号：US20180323089A1

公开(公告)日：2018-11-08

申请号：US15967788

申请日：2018-05-01

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Norifumi Kohama ,  Kimio Motoda

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67098 ,  H01L21/67259 ,  H01L21/683

Abstract: A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

公开(公告)号：US11482431B2

公开(公告)日：2022-10-25

申请号：US16964008

申请日：2019-01-11

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US09238245B2

公开(公告)日：2016-01-19

申请号：US13921286

申请日：2013-06-19

Applicant: Tokyo Electron Limited

Inventor： Takayuki Ishii ,  Kimio Motoda ,  Takashi Terada ,  Atsushi Yamashita ,  Shigeto Tsuruta

IPC: B05C5/02 ,  H01L21/67

CPC classification number: B05C5/0258 ,  B05C5/0254 ,  H01L21/6715 ,  Y10T137/0318

Abstract: A coating apparatus includes a nozzle, a moving mechanism, a pressure adjusting unit and a pressure control unit. The nozzle is provided with a storage chamber and a slit-like flow path, and configured to discharge the coating liquid from a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and a substrate relatively to each other along the surface of the substrate. The pressure adjusting unit adjusts the pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit so as to adjust pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit such that the inside of the storage chamber becomes a negative pressure, and fills the coating liquid inside the storage chamber while slowly decreasing the negative pressure inside the storage chamber.

Abstract translation: 涂布装置包括喷嘴，移动机构，压力调节单元和压力控制单元。 喷嘴设置有储存室和狭缝状流路，并且构造成从形成在流路前端的排出口排出涂布液。 移动机构沿着基板的表面使喷嘴和基板彼此相对移动。 压力调节单元调节储存室内的压力。 压力控制单元控制压力调节单元以调节储存室内的压力。 压力控制单元控制压力调节单元，使得储存室的内部成为负压，并且在缓慢减小储存室内的负压的同时，在储存室内填充涂布液。

公开(公告)号：US20140000518A1

公开(公告)日：2014-01-02

申请号：US13921286

申请日：2013-06-19

Applicant: Tokyo Electron Limited

Inventor： Takayuki Ishii ,  Kimio Motoda ,  Takashi Terada ,  Atsushi Yamashita ,  Shigeto Tsuruta

IPC: B05C5/02

CPC classification number: B05C5/0258 ,  B05C5/0254 ,  H01L21/6715 ,  Y10T137/0318

Abstract: A coating apparatus includes a nozzle, a moving mechanism, a pressure adjusting unit and a pressure control unit. The nozzle is provided with a storage chamber and a slit-like flow path, and configured to discharge the coating liquid from a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and a substrate relatively to each other along the surface of the substrate. The pressure adjusting unit adjusts the pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit so as to adjust pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit such that the inside of the storage chamber becomes a negative pressure, and fills the coating liquid inside the storage chamber while slowly decreasing the negative pressure inside the storage chamber.

Abstract translation: 涂布装置包括喷嘴，移动机构，压力调节单元和压力控制单元。 喷嘴设置有储存室和狭缝状流路，并且构造成从形成在流路前端的排出口排出涂布液。 移动机构沿着基板的表面使喷嘴和基板彼此相对移动。 压力调节单元调节储存室内的压力。 压力控制单元控制压力调节单元以调节储存室内的压力。 压力控制单元控制压力调节单元，使得储存室的内部成为负压，并且在缓慢减小储存室内的负压的同时，在储存室内填充涂布液。

公开(公告)号：US20230014665A1

公开(公告)日：2023-01-19

申请号：US17933983

申请日：2022-09-21

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US10964563B2

公开(公告)日：2021-03-30

申请号：US15967788

申请日：2018-05-01

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Norifumi Kohama ,  Kimio Motoda

IPC: H01L21/67 ,  H01L21/683

Abstract: A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

公开(公告)号：US20210035827A1

公开(公告)日：2021-02-04

申请号：US16964008

申请日：2019-01-11

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/68 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.