Invention Publication
- Patent Title: Composite Materials for Electronic Device Chassis and Related Methods
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Application No.: US18129524Application Date: 2023-03-31
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Publication No.: US20240210988A1Publication Date: 2024-06-27
- Inventor: David Pidwerbecki , Arvind S , Jeff Ku , Juha Tapani Paavola , Prakash Kurma Raju , Amruta Krishnakumar Ranade , Sudheera Sudhakar , Mousumi Deka , Snehal Chaudhari , Akarsha R. Kadadevaramath
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B32B5/02 ; B32B5/26 ; C23C14/20 ; C23C14/35 ; C23C16/06
Abstract:
Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
Information query
