公开(公告)号：US20240210988A1

公开(公告)日：2024-06-27

申请号：US18129524

申请日：2023-03-31

申请人： Intel Corporation

发明人： David Pidwerbecki ,  Arvind S ,  Jeff Ku ,  Juha Tapani Paavola ,  Prakash Kurma Raju ,  Amruta Krishnakumar Ranade ,  Sudheera Sudhakar ,  Mousumi Deka ,  Snehal Chaudhari ,  Akarsha R. Kadadevaramath

IPC分类号： G06F1/16 ,  B32B5/02 ,  B32B5/26 ,  C23C14/20 ,  C23C14/35 ,  C23C16/06

CPC分类号： G06F1/1615 ,  B32B5/02 ,  B32B5/26 ,  C23C14/205 ,  C23C14/35 ,  C23C16/06 ,  B32B2255/02 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2457/00

摘要： Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.