- 专利标题： TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS
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申请号： US18089483申请日： 2022-12-27
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公开(公告)号： US20240213164A1公开(公告)日： 2024-06-27
- 发明人: Minglu LIU , Gang DUAN , Liang HE , Ziyin LIN , Elizabeth NOFEN , Yiqun BAI , Jonathan ATKINS , Jesus S. NIETO PESCADOR , Srinivas V. PIETAMBARAM , Kristof DARMAWIKARTA
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/00 ; H01L23/522 ; H01L23/528
摘要：
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.
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