专利检索 ap:("Intel Corporation") AND inv:"Jonathan ATKINS" 第 1 页

1.

发明公开
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS 审中-公开

公开(公告)号：US20240213164A1

公开(公告)日：2024-06-27

申请号：US18089483

申请日：2022-12-27

申请人： Intel Corporation

发明人： Minglu LIU , Gang DUAN , Liang HE , Ziyin LIN , Elizabeth NOFEN , Yiqun BAI , Jonathan ATKINS , Jesus S. NIETO PESCADOR , Srinivas V. PIETAMBARAM , Kristof DARMAWIKARTA

IPC分类号： H01L23/538 , H01L23/00 , H01L23/522 , H01L23/528

CPC分类号： H01L23/5381 , H01L23/5226 , H01L23/5283 , H01L24/14 , H01L2224/16104

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.