Invention Publication
- Patent Title: METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS
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Application No.: US18147535Application Date: 2022-12-28
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Publication No.: US20240222259A1Publication Date: 2024-07-04
- Inventor: Haobo Chen , Bohan Shan , Xiyu Hu , Rhonda Jack , Catherine Mau , Hongxia Feng , Xiao Liu , Wei Wei , Srinivas Pietambaram , Gang Duan , Xiaoying Guo , Dingying Xu , Kyle Arrington , Ziyin Lin , Hiroki Tanaka , Leonel Arana
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/29 ; H01L23/31
Abstract:
Methods, systems, apparatus, and articles of manufacture to produce integrated circuit (IC) packages having silicon nitride adhesion promoters are disclosed. An example IC package disclosed herein includes a metal layer on a substrate, a layer on the metal layer, the layer including silicon and nitrogen, and solder resist on the layer.
Information query
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