Invention Application
- Patent Title: TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
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Application No.: US18478967Application Date: 2023-09-29
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Publication No.: US20250113428A1Publication Date: 2025-04-03
- Inventor: Min Suet Lim , Eng Huat Goh , Tin Poay Chuah , Kavitha Nagarajan , Telesphor Kamgaing , Poh Boon Khoo , Jiun Hann Sir
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/34 ; H05K3/40

Abstract:
Technologies for a shield for electromagnetic interference include a circuit board with an integrated circuit package on it, with a hole in the circuit board under the integrated circuit package. The integrated circuit package may include one or more dies or other components on the underside of the package, at least partially positioned in the hole in the circuit board. An electromagnetic shield box can be positioned in the hole. Tabs of the electromagnetic shield box may interface with pads on the same side of the circuit board as the integrated circuit package. The electromagnetic shield box may prevent or reduce electromagnetic or radiofrequency interference on the components of the integrated circuit package. Positioning the electromagnetic shield box can reduce the overall height of the circuit board, among other advantages.
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