发明授权
US4906823A Solder carrier, manufacturing method thereof and method of mounting
semiconductor devices by utilizing same
失效
焊料载体及其制造方法以及利用该半导体装置的半导体装置的安装方法
- 专利标题： Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
- 专利标题（中）： 焊料载体及其制造方法以及利用该半导体装置的半导体装置的安装方法
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申请号： US202027申请日： 1988-06-03
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公开(公告)号： US4906823A公开(公告)日： 1990-03-06
- 发明人: Tadao Kushima , Tasao Soga , Kazuji Yamada , Mitugu Shirai
- 申请人： Tadao Kushima , Tasao Soga , Kazuji Yamada , Mitugu Shirai
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-139791 19870605
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/12 ; H01L23/498 ; H05K3/34
摘要：
The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.
公开/授权文献
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