发明授权
- 专利标题： Epoxy resin composition and semiconductor devices encapsulated therewith
- 专利标题（中）： 环氧树脂组合物和封装的半导体器件
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申请号： US885965申请日： 1992-05-20
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公开(公告)号： US5298548A公开(公告)日： 1994-03-29
- 发明人: Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
- 申请人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-145502 19910521
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; C08G59/00 ; C08G59/20 ; C08G59/32 ; C08G59/38 ; C08G59/62 ; C08L63/00 ; H01B3/40 ; H01L23/29 ; H01L23/31 ; C08G59/22
摘要：
An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.