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1.发明授权
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。
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公开(公告)号：US5225484A
公开(公告)日：1993-07-06
申请号：US798750
申请日：1991-11-27
IPC分类号： C08G59/62 , C08G59/00 , C08G59/02 , C08G59/14 , C08G59/18 , C08G59/32 , C08G59/40 , C08K5/5425 , C08L63/00 , C08L101/00 , H01L23/29 , H01L23/31
CPC分类号： C08L63/00 , C08G59/02 , C08G59/1444 , C08G59/3218 , C08L101/00
摘要： A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.
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3.发明授权Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith 失效含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
公开(公告)号：US5166228A
公开(公告)日：1992-11-24
申请号：US739447
申请日：1991-08-02
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08L63/00 , C08L63/04 , C08L83/05 , H01B3/40 , H01L23/29 , H01L23/31
摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。
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4.发明授权
公开(公告)号：US5162400A
公开(公告)日：1992-11-10
申请号：US713841
申请日：1991-06-12
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/20 , C08G59/24 , C08G59/32 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.
摘要翻译： 一种环氧树脂组合物，其包含（A）在分子中具有至少两个环氧基的环氧树脂，（B）分子中具有至少一个萘环的酚醛树脂和（C）无机填料，具有改善的流动性和固化性 具有低膨胀系数，高Tg，低吸湿性的产品。 因此，该组合物适用于封装半导体器件。
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5.发明授权公开(公告)号：US06297306B1
公开(公告)日：2001-10-02
申请号：US09310924
申请日：1999-05-13
IPC分类号： C08K310
CPC分类号： C08K3/22 , C08K3/2279 , C08K2003/2227 , C08L63/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）联苯骨架环氧树脂，（B）作为固化剂的联苯骨架酚醛树脂，（C）钼化合物和（D）无机填料适合于半导体封装，因为它是有效模塑的 并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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6.发明授权公开(公告)号：US06291556B1
公开(公告)日：2001-09-18
申请号：US09534386
申请日：2000-03-24
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： C08K6300
CPC分类号： H01L23/293 , C08K3/2279 , C08K9/08 , C08K2003/026 , C08K2201/019 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）包含涂覆有热塑性树脂和/或热固性树脂的红磷基芯的微胶囊阻燃剂， （D）钼化合物和（E）无机填料。 即使没有卤化环氧树脂和氧化锑，该组合物及其固化产品具有防湿可靠性和高阻燃性。
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7.发明授权公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
申请人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
发明人： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC分类号： H01L2329
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
摘要： A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
摘要翻译： 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。
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8.发明授权公开(公告)号：US06723452B2
公开(公告)日：2004-04-20
申请号：US10196222
申请日：2002-07-17
申请人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
发明人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/20 , C08G59/245 , C08G59/3218 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L2666/22 , H01L2924/00
摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
摘要翻译： 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。
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9.发明授权公开(公告)号：US06177489B1
公开(公告)日：2001-01-23
申请号：US09003517
申请日：1998-01-06
申请人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
发明人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
IPC分类号： C08L6302
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K3/36 , C08K5/20 , C08K5/5397 , C08K5/54 , C08L63/00 , C09K21/14 , H01L2924/0002 , C08L83/00 , C08L2666/22 , H01L2924/00
摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
摘要翻译： 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。
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10.发明授权
公开(公告)号：US6162878A
公开(公告)日：2000-12-19
申请号：US310999
申请日：1999-05-13
IPC分类号： C08G59/08 , C08G59/20 , C08G59/40 , C08G59/62 , C08K3/00 , C08L61/04 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/08 , C08G59/4085 , C08L61/04 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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