-
1.发明授权
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。
-
公开(公告)号：US5225484A
公开(公告)日：1993-07-06
申请号：US798750
申请日：1991-11-27
IPC分类号： C08G59/62 , C08G59/00 , C08G59/02 , C08G59/14 , C08G59/18 , C08G59/32 , C08G59/40 , C08K5/5425 , C08L63/00 , C08L101/00 , H01L23/29 , H01L23/31
CPC分类号： C08L63/00 , C08G59/02 , C08G59/1444 , C08G59/3218 , C08L101/00
摘要： A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.
-
3.发明授权Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith 失效含有多羟基化合物环氧树脂和基于苯乙烯的酚醛树脂固化剂的环氧树脂组合物和其中包含的半导体器件
公开(公告)号：US5166228A
公开(公告)日：1992-11-24
申请号：US739447
申请日：1991-08-02
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/08 , C08G59/20 , C08G59/32 , C08L63/00 , C08L63/04 , C08L83/05 , H01B3/40 , H01L23/29 , H01L23/31
摘要： An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
摘要翻译： 包含（A）特定环氧树脂，（B）在分子中具有至少一个萘环的酚醛树脂和（C）无机填料的环氧树脂组合物具有改善的流动性并固化成具有低膨胀系数的产品， 高Tg，低吸湿性。 该组合物适用于封装半导体器件。
-
4.发明授权
公开(公告)号：US5162400A
公开(公告)日：1992-11-10
申请号：US713841
申请日：1991-06-12
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/20 , C08G59/24 , C08G59/32 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.
摘要翻译： 一种环氧树脂组合物，其包含（A）在分子中具有至少两个环氧基的环氧树脂，（B）分子中具有至少一个萘环的酚醛树脂和（C）无机填料，具有改善的流动性和固化性 具有低膨胀系数，高Tg，低吸湿性的产品。 因此，该组合物适用于封装半导体器件。
-
公开(公告)号：US4985751A
公开(公告)日：1991-01-15
申请号：US404600
申请日：1989-09-08
CPC分类号： H01L23/3135 , C08G59/1438 , C08L63/04 , H01L23/295 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181
摘要： A resin-encapsulated semiconductor device is of the structure wherein a silicon chip on a die pad is encapsulated with a molding resin. The rear surface of the die pad remote from the silicon chip, preferably the entire surfaces of the elements are treated with a primer, typically a silane coupling agent and a low stress epoxy resin encapsulant is used, preventing the encapsulating resin from separating and cracking upon subsequent dipping in solder bath.
摘要翻译： 树脂封装的半导体器件是其中芯片焊盘上的硅芯片用模制树脂封装的结构。 远离硅芯片的芯片的后表面，优选地，元件的整个表面用底漆处理，通常使用硅烷偶联剂和低应力环氧树脂密封剂，防止封装树脂分离和开裂 随后浸入焊锡槽。
-
公开(公告)号：US20120279273A1
公开(公告)日：2012-11-08
申请号：US13456740
申请日：2012-04-26
摘要： A product including a top surface part, a vertical wall part connected to an end of the top surface part and a corner part interposed between the top surface part and the vertical wall part is manufactured by flowing a material of the corner part toward the top surface part while applying a pressing force on a workpiece.
摘要翻译： 通过使角部的材料向顶面流动而制造出包括上表面部分，连接到顶表面部分的端部的垂直壁部分和插入在顶表面部分和垂直壁部分之间的角部分的产品 同时在工件上施加按压力。
-
公开(公告)号：US07746387B2
公开(公告)日：2010-06-29
申请号：US11724253
申请日：2007-03-15
申请人： Masami Ogata , Takashi Tsuchiya , Kazuhiko Ueda
发明人： Masami Ogata , Takashi Tsuchiya , Kazuhiko Ueda
CPC分类号： H04N5/35581 , H04N5/2353 , H04N5/2355 , H04N5/3415 , H04N5/35554
摘要： In an image pickup apparatus, a level compensator compensates the level of an image xL (i, j) sensed by an image sensor by exposure for a long time on the basis of the exposure of the image to produce a compensated image xL′ (i, j), while another level compensator compensates the level of an image xS (i, j) sensed by the image sensor by exposure for a short time on the basis of the exposure of the image to produce a compensated image xS′ (i, j). The image pickup apparatus also includes an image synthesizer to synthesize these compensates images xL′ (i, j) and xS′ (i, j) to produce a single synthetic image x (i, j). A dynamic range compressor also included in the image pickup apparatus compresses the synthetic image x (i, j) to produce a compressed image y (i, j) for delivery to outside.
摘要翻译： 在图像拾取装置中，电平补偿器基于图像的曝光来补偿由图像传感器感测的图像xL（i，j）的电平，以产生补偿图像xL'（i ，j），而另一个电平补偿器基于图像的曝光补偿由图像传感器感测到的图像xS（i，j）的电平，以产生补偿图像xS'（i，j） j）。 图像拾取装置还包括用于合成这些补偿图像xL'（i，j）和xS'（i，j）以产生单个合成图像x（i，j）的图像合成器。 还包括在图像拾取装置中的动态范围压缩器压缩合成图像x（i，j）以产生用于传送到外部的压缩图像y（i，j）。
-
公开(公告)号：US07557834B2
公开(公告)日：2009-07-07
申请号：US10528401
申请日：2004-07-16
申请人： Katsumi Kaneko , Takashi Tsuchiya
发明人： Katsumi Kaneko , Takashi Tsuchiya
IPC分类号： H04N5/228
摘要： An image signal generation portion 11 generates an image signal of a variable frame-rate picked-up image. A signal generation control portion 24 drives the image signal generation portion 11 and generates image pick-up setting information IF to generate an image signal that is frame-synchronized with a generated image signal DVd. The generated image signal DVd is output in condition where the image pick-up setting information IF is inserted in it. When supplied with image pick-up setting information IFex, the signal generation control portion 24 controls the driving operations of the image signal generation portion 11 based on the image pick-up setting information IFex, to frame-synchronize the generated image signal with an image signal of a reference variable frame-rate picked-up image of a source that has supplied the image pick-up setting information IFex. If a plurality of image pick-up devices capable of varying a frame rate is used, the image signals can be frame-synchronized with each other.
摘要翻译： 图像信号生成部分11生成可变帧率拍摄图像的图像信号。 信号发生控制部分24驱动图像信号产生部分11并产生图像拾取设置信息IF以产生与产生的图像信号DVd进行帧同步的图像信号。 在其中插入图像拾取设置信息IF的条件下输出所生成的图像信号DVd。 当提供图像拾取设置信息IFex时，信号产生控制部分24基于图像拾取设置信息IFex控制图像信号生成部分11的驱动操作，以使图像信号与图像同步 提供图像拾取设置信息IFex的源的参考可变帧速率拾取图像的信号。 如果使用能够改变帧速率的多个图像拾取装置，则图像信号可以彼此帧同步。
-
公开(公告)号：US20070047034A1
公开(公告)日：2007-03-01
申请号：US11592155
申请日：2006-11-03
申请人： Masami Ogata , Takashi Tsuchiya , Kazuhiko Ueda
发明人： Masami Ogata , Takashi Tsuchiya , Kazuhiko Ueda
IPC分类号： G03F3/08
CPC分类号： G06T5/40 , G06T5/009 , G06T5/10 , G06T2207/10012 , H04N1/4072 , H04N5/20 , H04N5/57
摘要： The invention provides an image processing apparatus and an image processing method. An area to which image data belongs is discriminated, and a correction coefficient to be used for correction of a pixel value of the image data is produced based on a result of the discrimination. Then, the pixel value of the image data is corrected with the correction coefficient. The relationship in magnitude among pixel values in the same area is maintained because the same coefficient is used, but pixel values which belong to different areas can be varied or even reversed. This allows the gradation of an entire image to be corrected while preventing partial deterioration of the contrast.
-
公开(公告)号：US20060123620A1
公开(公告)日：2006-06-15
申请号：US11351949
申请日：2006-02-10
IPC分类号： B23Q39/04
CPC分类号： B21D39/00 , B21D28/06 , B21D35/007 , B62D25/105 , B62D65/00 , Y10T29/49622 , Y10T29/49908 , Y10T29/5116 , Y10T29/5124 , Y10T29/5136 , Y10T29/5137 , Y10T29/53383 , Y10T29/53387 , Y10T29/53417 , Y10T29/53422 , Y10T29/53996 , Y10T403/49 , Y10T403/4966 , Y10T403/4991
摘要： A vehicular body panel or component part having a reinforcing backing plate reconciled or joined to a part of a blank material at a position wherein a bending formation is implemented. The backing plate has one or more apertures formed in at least one lateral row at a location equivalent to the position of the bending formation. When forming the blank material and the backing plate concurrently by a bending operation, the backing plate becomes intimately associated with the blank sheet to avoid the backing plate from locally separating from the blank material and from forming a gap relative thereto, with a resultant improved product quality.
摘要翻译： 具有加强背衬板的车身面板或部件部件在实现弯曲形成的位置处调整或接合到坯料材料的一部分。 背板具有在与弯曲结构的位置相当的位置处形成在至少一个横排中的一个或多个孔。 当通过弯曲操作同时形成坯料和背板时，背板将与坯料片紧密地相关联，以避免背板与坯料材料局部分离，并相对于其形成间隙，得到改进的产品 质量。
-
-
-
-
-
-
-
-
-
搜索结果
71 条记录 (耗时 0.038 秒)
