Invention Grant
US6162878A Semiconductor encapsulating epoxy resin composition and semiconductor
device
有权
半导体封装环氧树脂组合物和半导体器件
- Patent Title: Semiconductor encapsulating epoxy resin composition and semiconductor device
- Patent Title (中): 半导体封装环氧树脂组合物和半导体器件
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Application No.: US310999Application Date: 1999-05-13
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Publication No.: US6162878APublication Date: 2000-12-19
- Inventor: Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
- Applicant: Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
- Applicant Address: JPX Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX10-152071 19980515
- Main IPC: C08G59/08
- IPC: C08G59/08 ; C08G59/20 ; C08G59/40 ; C08G59/62 ; C08K3/00 ; C08L61/04 ; C08L63/00 ; C08L83/04 ; H01L23/29 ; H01L23/31
Abstract:
An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
Public/Granted literature
- US5922444A Glaze composition Public/Granted day:1999-07-13
Information query
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