发明授权
US6162878A Semiconductor encapsulating epoxy resin composition and semiconductor
device
有权
半导体封装环氧树脂组合物和半导体器件
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
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申请号： US310999申请日： 1999-05-13
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公开(公告)号： US6162878A公开(公告)日： 2000-12-19
- 发明人: Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
- 申请人： Shoichi Osada , Kazutoshi Tomiyoshi , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX10-152071 19980515
- 主分类号： C08G59/08
- IPC分类号： C08G59/08 ; C08G59/20 ; C08G59/40 ; C08G59/62 ; C08K3/00 ; C08L61/04 ; C08L63/00 ; C08L83/04 ; H01L23/29 ; H01L23/31
摘要：
An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
公开/授权文献
- US5922444A Glaze composition 公开/授权日：1999-07-13