- 专利标题： Semiconductor copper bond pad surface protection
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申请号： US10153451申请日： 2002-05-22
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公开(公告)号： US06885104B2公开(公告)日： 2005-04-26
- 发明人: Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- 申请人： Timothy W. Ellis , Nikhil Murdeshwar , Mark A. Eshelman , Christian Rheault
- 申请人地址： US DE
- 专利权人： Kulicke & Soffa Investments, Inc.
- 当前专利权人： Kulicke & Soffa Investments, Inc.
- 当前专利权人地址： US DE
- 代理机构： Synnestvedt & Lechner LLP
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/60 ; H01L23/485 ; H01L23/498 ; H05K3/28 ; H01L29/40 ; H01L21/94 ; B23K20/12 ; B23K31/02 ; B23K1/00
摘要：
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
公开/授权文献
- US20020135077A1 Semiconductor copper bond pad surface protection 公开/授权日：2002-09-26