发明授权
US06949815B2 Semiconductor device with decoupling capacitors mounted on conductors
失效
具有去耦电容器的半导体器件安装在导体上
- 专利标题： Semiconductor device with decoupling capacitors mounted on conductors
- 专利标题（中）： 具有去耦电容器的半导体器件安装在导体上
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申请号： US10746603申请日： 2003-12-23
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公开(公告)号： US06949815B2公开(公告)日： 2005-09-27
- 发明人: Takao Yamazaki , Toru Mori , Akinobu Shibuya , Shintaro Yamamichi , Yuzo Shimada
- 申请人： Takao Yamazaki , Toru Mori , Akinobu Shibuya , Shintaro Yamamichi , Yuzo Shimada
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Katten Muchin Rosenman LLP
- 优先权： JP2000-360853 20001128
- 主分类号： H05K3/34
- IPC分类号： H05K3/34 ; H01L21/60 ; H01L21/822 ; H01L23/12 ; H01L23/50 ; H01L23/64 ; H01L27/04 ; H01L23/52 ; H01L23/32 ; H01L23/48 ; H01G9/05
摘要：
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
公开/授权文献
- US20040135264A1 Semiconductor device and method for packaging same 公开/授权日：2004-07-15