发明授权
- 专利标题： High frequency module mounting structure in which solder is prevented from peeling
- 专利标题（中）： 防止焊料剥离的高频模块安装结构
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申请号： US10440931申请日： 2003-05-19
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公开(公告)号： US06950315B2公开(公告)日： 2005-09-27
- 发明人: Masanobu Ujiie , Atsushi Murata , Daijo Shibata , Kiminori Terashima
- 申请人： Masanobu Ujiie , Atsushi Murata , Daijo Shibata , Kiminori Terashima
- 申请人地址： JP Tokyo
- 专利权人： Alps Electric Co., Ltd.
- 当前专利权人： Alps Electric Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Brinks Hofer Gilson & Lione
- 优先权： JP2002-143963 20020520
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H05K1/02 ; H05K1/14 ; H05K3/34 ; H05K3/36 ; H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
摘要：
In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.
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