公开(公告)号：US06452112B1

公开(公告)日：2002-09-17

申请号：US09420292

申请日：1999-10-18

申请人： Kiminori Terashima ,  Hiroshi Harada

发明人： Kiminori Terashima ,  Hiroshi Harada

IPC分类号： H05K116

CPC分类号： H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

摘要： The electronic circuit unit of the present invention is provided with the broad width lands and the thin width lands tied with the broad width lands, which are configured by a solder resist that is formed on the surface of the circuit board. Owing to this configuration, the solders placed on the thin width lands are drawn toward the broad width lands, which increases the quantity of the solder buildup on the broad width lands, and accompanied with this increase, swells the heights of the solder buildup on the broad width lands. Thus, the electronic circuit unit of the present invention ensures the soldering.

摘要翻译： 本发明的电子电路单元设置有宽宽的焊盘和与宽宽焊盘相连接的薄的宽度焊盘，其由形成在电路板的表面上的阻焊剂构成。 由于这种构造，放置在薄宽度焊盘上的焊料被拉向宽阔的焊盘区域，这增加了宽宽焊盘上的焊料积聚量，伴随着这种增加，焊料积聚的高度膨胀在 宽阔的土地。 因此，本发明的电子电路单元确保了焊接。

公开(公告)号：US06518512B2

公开(公告)日：2003-02-11

申请号：US10017431

申请日：2001-12-14

申请人： Kiminori Terashima

发明人： Kiminori Terashima

IPC分类号： H05K116

CPC分类号： H05K3/303 ,  H05K1/0269 ,  H05K13/08 ,  H05K2201/09281 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/4913

摘要： According to a structure for inspecting the alignment of a mounted electrical component of the present invention, a wiring pattern has fiducial portions extending closely along at least two outer edges of a rectangular electrical component. Accordingly, conventional silk-screen printed markers can be eliminated, resulting in a more productive and less expensive structure for inspecting the alignment of a mounted electrical component.

公开(公告)号：US06950315B2

公开(公告)日：2005-09-27

申请号：US10440931

申请日：2003-05-19

申请人： Masanobu Ujiie ,  Atsushi Murata ,  Daijo Shibata ,  Kiminori Terashima

发明人： Masanobu Ujiie ,  Atsushi Murata ,  Daijo Shibata ,  Kiminori Terashima

IPC分类号： H01L23/12 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K3/3436 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/09781 ,  Y02P70/613

摘要： In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.

摘要翻译： 在根据本发明的高频模块安装结构中，电路板包括在其下表面上的增强电极，用于在接近的状态下增加第一和第二电极组的安装强度，母板包括 在与焊盘接近的状态下对应于加强电极的加强焊盘，电极和焊盘以及加强电极和加强焊盘进行焊接。 因此，高频模块相对于母板的焊接得到增强，因此提供了可靠的高频模块安装结构。

公开(公告)号：US06399893B1

公开(公告)日：2002-06-04

申请号：US09301503

申请日：1999-04-28

申请人： Kiminori Terashima

发明人： Kiminori Terashima

IPC分类号： H05K116

CPC分类号： H05K9/0028 ,  H05K3/3405 ,  H05K3/3447 ,  H05K7/02 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/2018

摘要： In the electronic device of the present invention, leg portions of a frame are projected downward from the underside of a printed circuit board, so the positioning of the electronic device can be done by inserting the leg portions into holes formed in a mother printed circuit board. Thus, when the electronic device is surface-mounted to the mother board, there is no fear of its dislocation even under vibration or shock. Accordingly, the electronic device is not deteriorated at all in its quality.

摘要翻译： 在本发明的电子设备中，框架的脚部从印刷电路板的下侧向下突出，因此电子设备的定位可以通过将脚部插入母版印刷电路板中形成的孔中 。 因此，当将电子装置表面安装到母板时，即使在振动或冲击下也不会发生其位错的担心。 因此，电子设备的质量根本不劣化。